12КС -31684 -1103

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12КС -31684 -1103

BION-M SPACECRAFT
Scientific hardware design specification
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CONTENT
Introduction…………………………………………………………….
1 Basic requirement………………………………………………………
2. Mechanical interface…………………………………………………
3. Electrical interface………………………………………….…………
3.1 Electrical interface general requirements…………………………
3.2 Power interface……………………………………………..……
3.3 Control interface………………………………………….………
3.4 Telemetry system interface………………………………………
3.5 Noise immunity and noise generation requirements……………
3.6 Electromagnetic compatibility requirements……………………
4. Heat exchange requirements…………………………………………..
5. Operational requirements…………………………………………….
5.1 Storage ….…………………………………………………….…
5.2 Transportation ……………………………………………………
5.3 The S/C assembly and testing procedures……………………….
5.4 Launch pad operations……………………………………………
5.5 Injection (flight in the LV complement…………………………
5.6 Orbital flight ….………………………………………..………
5.7 The S/C flight termination………………………………………
5.8 Vibration, shock and acoustic actions……………………………
5.9 Radiation exposures……………………………………………
6. Standard schedules of works carried out with the S/H………………..
6.1 Ground checkout procedures of the S/H in the S/C complement
7. Reliability requirements………………………………………….…
8. Safety requirements………………………………………...………
9. Ground support equipment requirements…………..………………
10. Storage, packing and marking requirements……………..…………
11 Work steps, documents to be submitted……………………………
Annex A (obligatory) Outline drawings requirements.…………………
Annex B (obligatory) The S/H mass dummy unit requirements………
Annex C (obligatory) Interblock cables outline drawings requirements.
Annex D РСТВ connector characteristics………………………………
Annex E Recommended schemes of the S/H output devices ..…………
Annex F The S/H operational manual requirements……………………
Annex G Service log…………………………………………….………
Annex H Initial data of Radio-Electronic Devices (RED)………………
Annex I Preliminary technological schedule of operations to be carried out
with BION-M launch vehicle system at the Baikonur space range….
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List of abbreviations ……………………………………..………………
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INTRODUCTION
Present document is developed in accordance with Project Evaluation Schedule No 7909-12КС-2908-2006 and defines design specifications on newly designed
scientific hardware for accommodation in the BION-M spacecraft. It contains the
description of interfaces between spacecraft and scientific hardware.
Scientific hardware shall be designed in conformity with especially dedicated
document “Polozenie NA-99”.
Some requirements may be specified and supplemented during the process of
scientific hardware designing by mutual agreement.
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1 BASIC REQUIREMENT
1.1 Spacecraft (S/C) consists of the re-entry capsule (RC), the service module
(SM), the propulsion module (PM), the separation system platform (SSP), the solar
battery (SB) and other parts of the S/C general assembly. Re-entry capsule and service module are pressurized.
1.2 Scientific hardware (S/H) can be accommodated inside RC and on the external face of it, in case of necessity of the S/H recovery. If there is no need of S/H
recovery, it can be installed on SSP and inside SM.
1.3 Total mass of S/H, accommodated inside RC and on the external surface
of it, shall be no more than 600 kg, of S\H accommodated on SSP shall be no more
than 200 kg, and of S/H accommodated inside SM shall be no more than 100 kg.
1.4 The names of S/H and its components shall be invariable in all documen-
tation.
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2 MECHANICAL INTERFACE
2.1 Mechanical interface is developed in the process of S/H designing with the
assistance of “TsSKB-Progress”.
2.2 Outline drawings shall contain data on the S/H mechanical interface. Outline drawings requirements are given in Annexes A and B.
2.3 Outline drawings shall be provided for every separate unit (instrument) of
the S/H, for rigging devices (if units are installed by means of rigging devices produced by the S/H developer), for units in assembly with rigging devices, for interblock cables and for pipelines.
2.4 The S/H structure shall keep its operability under environmental factors
exposure and after it. These factors are specified in Section 5 of the present docu-
ment.
2.5 The S/H, its structural elements and the attachment points (including
“shock-absorber – instrument” system) shall not have resonances in the range up to
25Hz.
2.6 The S/H structure shall be easy serviceable at mounting into the S/C and
its dismantling. It shall guarantee safety during its handling in storage, transportation, testing, assembly (disassembly). The S/H structure shall allow free access to its
attachment elements to the S/C.
2.7 The S/H structure shall not allow the possibility of electro-, air-, and hydro-connectors mixing up during its coupling with the mating parts.
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2.8 Test connectors (non-flight ones) shall have protective caps. Their loosening shall be avoided.
2.9 Process structural elements, which are removed during preliminary operating procedures, including electro-, air- and hydro-connectors, shall be painted red,
marked and have captive fasteners. The red marks on other elements are not allowed.
2.10 To protect the S/H from static electricity, it shall have a bonding stud as
shown in the sketch below:
18
М5
Bonding stud
Instrument
12
Bonding stud shall be located at that structural element, which allows gripping
of the stud in the process of bonding terminal fixation.
“Stud – housing” intermediate resistance shall not be more than 200 µΩ (if
housing is made of magnesium-base alloy, the resistance shall be no more than 300
µΩ).
To measure intermediate resistance, a special place without coating on the
housing shall be foreseen, not farther than 25 mm from bonding stud. In case of the
lack of a special measuring place, local removal of coating from housing is allowed;
it shall be subsequently restored, if necessary.
2.11 If it is not possible to deliver the S/H flight model to the S/C producerfactory, the S/H mass dummy units (MDU) shall be provided in order to determine
actual mass magnitude and mass centre position, to produce pipelines, to check instruments arrangement, assembly and multi-layer insulation (MLI), to develop the
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S/H integration procedures. MDU of the S/H, delivered directly to the space range,
shall meet the S/H operational requirements, given in the present document (it
means it should be a flight model). MDU requirements are given in Annex B.
2.12 The instrument with mass more than 20 kg shall be installed on board of
the S/C by means of a special rigging device, which shall be delivered together with
hardware or its MDU. To fix manipulator mechanism, rigging device shall have 3 –
4 apertures of M12 type with no less than 18 mm of depth.
2.13 The material, used for the S/H structure production, shall provide for allowable compatibility with the elements of the S/H structure.
2.14 Fastening of MLI to the hardware (hook-and-loop fasteners gluing) shall
be allowed, when the S/H is installed on the S/C external surface.
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3 ELECTRICAL INTERFACE
3.1 ELECTRICAL INTERFACE GENERAL REQUIREMENTS
3.1.1. Control commands, power supply, data, warning and telemetry circuits
shall be separated using different connectors, its shall be galvanic isolated from each
other and from the S/H cases, and the S/H itself should be operable in case of fault
operation of one S/C power bus outside of the S/H.
Power supply, data and control command circuits shall be passed through the
redundant (dubbed) connectors. Each connector shall receive both power polarities
in order to exclude contingencies related to the accidental mixing up of cables during its attachment to the on-board equipment (OE).
The arrangement of soldered dubbed connectors along the control command
circuit shall be identical to the arrangement of power supply circuits (except the soldering of wire used for connector attachment control).
3.1.2. Insulation resistance of electrical circuits between the S/H and the S/C
systems regarding S/C case, and between any electrically disconnected circuits, shall
be no less than 20 megaohm. under the average environmental conditions.
3.1.3. Electrical circuit insulation between the S/H and the S/C systems, oper-
ated in conditions of environmental factors influence, specified in this document,
shall guarantee enough electrical strength for breakdown prevention.
3.1.4. Measures against wrong attachment of connectors shall be taken and
possibility of connector attachment accuracy control using streamline method shall
be foreseen in the S/H. Current in the circuit shall be no more than 5 mA. Voltage in
open circuit shall be no more than 5V. Circuit resistance shall be no more than 1 kilohm.
3.1.5. The part of connector mounted on hardware and the mating part of connector mounted on cables shall have identical name marking.
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3.1.6. Interblock cables shall be produced by the S/H designer. Cable length
shall be agreed with the S/C designer. Interblock cables outline drawings requirements are given in Annex C.
Connectors of РСТВ type are used to connect the S/H and the S/C. Connectors characteristics are given in Annex D.
3.1.7
Scientific hardware shall guarantee control of all the OE connec-
tions (including standby connections check). If the S/H has continuous work time
limitation, then it shall be equipped with automatic shutdown system.
Note – In the process of monitoring and measuring system (MMS) OE
functioning testing in the mode of single command (SC) relay, the S/H shall not require continuous work during more than 34 minutes or more than 35 minutes in total
at work interval of 70 minutes. The subsequent break interval in the work of MMS
OE shall be 35 minutes.
3.1.8
Processing and testing operations of the S/H in assembly with
S/C are conducted at the producer factory and in processing facility by means of
ground testing facility (GTF) and ground support equipment (GSE) of the S/H (if
necessary). The S/H - GTF interface shall come directly through the S/C OE. In
this connection the S/H functional testing shall be carried out by signaling to GTF,
telemetry data from the S/H and engineering information from the S/H to its GSE.
3.1.9
In case of impossibility of access to the S/H connectors after installation of the S/H on the S/C board, the S/H developer shall produce flight extension cables to interface the S/H with GSE. Extension cables are assigned for
laying inside the S/C from the S/H to the possible area of its connection to GSE.
3.1.10
Signalling to GTF of the S/H functioning at testing shall be gen-
erated by non-powered contacts under the following signal circuits characteristics:
quantity of signals that S/H needs shall be defined at the stage of operational documents development;
input current shall be from 10.5 to 24 mA;
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voltage shall be from 24 to 32 V;
interference protection at the input, with 15 V of amplitude;
minimal duration of pulse input signal shall be 10 msec.
3.1.11
The need of static elimination from cables connected to the S/H
by means of special plugs shall be included in the S/H interconnection scheme
with indication of particular connectors. The plugs are supplied by the S/H developer (if necessary).
3.1.12 The S/H shall not require adjustment and other servicing at the launch
pad.
3.2 POWER INTERFACE
3.2.1. The S/H power voltage shall be in the range from 23 to 32 V in a
steady-state mode, and 22 V in transient modes at a time period of no more than 200
msec.
3.2.2. Average daily power consumption of all the S/H shall not exceed 450
W:
Power consumption of a particular S/H shall be defined at the S/H basic data
coordination.
3.2.3. Inom value of the S/H with the highest power consumption rate shall not
exceed 15 A.
3.2.4. The values of current in a steady-state mode and in a pulse (inrush)
mode are given in the interconnection schemes of the particular S/H. In this connection, pulse mode duration shall not exceed 200 msec., rate of pulse rise shall not be
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more than 3 A/msec.
3.2.5. The S\H shall provide a guaranteed switching off by commands of the
S/C control system.
3.2.6. Both terminals (polarities) of power bus shall be commutated in the
S/H, current overload protection shall be performed by the S/H components. Current
protection selection shall guarantee Iinrush =2 Inom at a time period of 210 msec. Filter
capacitor installed at the system input in the S/H primary power circuit shall be
connected through circuit elements guarantying current rise during the S/H activation in accordance with item 3.2.4 of requirements and inrush current limitation up
to 2 Inom during time period of no more than 200 msec.
3.2.7. The S/H power circuit commutation and protection are performed by
3.2.8. Secondary voltage circuits in the S/H instruments shall be galvanic isolated from primary voltage circuits and from each other.
subsequent voltage supply without disconnection of contacts.
3.3.1 In flight the S/C control system delivers the following control actions to
the S/H:
3.2.9. The S/H shall permit emergency voltage dump at ground testing, and
the S/C facilities in exceptional cases.
3.2.10.
At ground processing the S/H shall be electrically powered from
ground power supply sources.
3.3 CONTROL INTERFACE
single commands (SC) are generated at communication sessions;
control commands (CC) are set at temporal programs and generated at
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fixed time.
3.3.2 At ground processing of the S/H, TKU control commands can be used.
Duration of TKU is from 0.09 to 0.3 sec.
3.3.3 SC and CC can be given to the S/H by means of commands from GTF,
if necessary. The S/H shall be interfaced with GTF directly through the S/C OE.
Note – The amount of commands necessary to the S/H control and the list of
commands relayed from GTF shall be determined at the S/H basic data correlating.
3.3.4. Control commands (SC, CC, TKU) are relayed to the S/H as a pulse of
minus 27V, from 23 to 34 V of voltage with respect to plus 27 V of “common command”, which do not have connection with the S/H power lines.
Load current in commands circuits (SC, CC, TKU) shall be no more than
0.4А and no less than 0.01А.
Duration of nominal control commands (SC, CC) is from 0.09 to 0.3 sec. Mi-
nimal interval between two nominal control commands is 1 sec.
3.3.5 The S/H output connectors shall be led to both polarities of the receiving elements of each control command.
3.3.6 The S/H shall not loose its operability and disable devices connected to
it, in case of control logic failure, and shall permit multiple delivery of one and the
same command from the S/C control system.
3.3.7 All the windings of electromagnetic devices (relays, switches, engine
winding, valve winding, etc) shall be shunted by diodes.
3.4 TELEMETRY SYSTEM INTERFACE
3.4.1 The S/H telemetry data (TM) is collected, processed, stored and transmitted to the ground reception facilities by means of the S/C radio-telemetry system
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(TMS) in the following modes:
direct TM-data transmission mode;
continuous TM-data storage mode (no less than 90 min.);
discontinuous (discrete) TM-data storage mode, recording time is 250
sec, the interval between two recording sessions is 60 minutes. Total
memory capacitance is 90 minutes.
3.4.2 The TMS analog and digital channels designed for monitoring the S/H
parameters have the following sampling frequency:
50 Hz in the direct transmission mode (DT);
1; 2; 3; 50 Hz in ЗАП1, ЗАП2, ЗАП3, ЗАП50 modes (storage modes),
respectively.
TMS has analog and digital channels. One digital channel has 8 inputs (bits).
coded sensor.
It is permitted to connect not more than one analog sensor per each analog
channel.
parameters have the following sampling frequency:
mined at the S/H basic data correlating.
The TMS channels designed for telemetry monitoring of the S/H temperature
Each input may be connected to either one signal sensor or one bit of an analog or
2.56 sec in DT mode;
128; 64; 43; 2.56 sec in ЗАП1, ЗАП2, ЗАП3, ЗАП50 modes, respectively.
3.4.3 The number of TMS channels allocated for a particular S/H is deter-
3.4.4 To provide the formation of the telemetry parameters the S/H shall have
built-in sensors and/or transducers (referred to as “sensors”) with output devices of
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the following types:
a) Analog-parametric devices (potentiometers, potential divider) with output
resistance from 1 to 4 kilohm powered by TMS measurement voltage source
(6.25±0.03)V with current of consumption from each source of no more than 100
mA and system interrogation current of no more than 20 microamp.
In the S/H circuit measures shall be taken to protect the "+6.3 V" circuit from
current overload.
b) Analog-generating devices in the form of the circuits with output voltage
from 0 to 6.25 V at TMS current of no more than 20 microamp. during circuit interrogation. To provide minimal measuring error, circuit output resistance shall be no
more than 1 kilohm. If necessary, it is allowed to increase resistance up to 10 kilohm
with measuring error increasing.
c) Discrete-parametric devices in the form of switches, relay contacts, etc.
powered at interrogation by the TMS measurement current of 0.1 – 0.6 mA. with the
output resistance:
- of no more than 100 ohm at«Logical 0»;
- of no less than 100 kiloohm. at «Logical 1».
d) Discrete-parametric devices in the form of electronic or optron switches
powered at interrogation by the TMS measurement current of 0 – 0.6 mA. with the
output voltage:
- of 0 - 0.7 V (the switch is open) at «Logical 0»;
- of no more than 5.5 V (the switch is closed) at «Logical 1».
The reverse current of closed switch commutator shall not exceed 50 microamp. and power voltage generated by TMS shall not be more than 5.5V.
e) Discrete-generating devices (microcircuit outputs, circuits with output resistance of no more than 1 kilohm, etc.) with the output voltage:
- - of minus 1 to plus 0.7 V at "Logical 0";
- - of 2.2 - 10 V at "Logical 1",
- interrogating current from system is 0 – 0.6 mA.
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It is allowed to use power for these devices from TMS source (5±0.5) V using
connectors of data collecting units with total consumption current of no more
than 200 mA from each unit.
f) Discrete-generating devices (microcircuits outputs, circuits with output
resistance from 1 kilohm to 10 kilohm) without taking into account TMS measuring current with output voltage:
- - from minus 1 to plus 0.7 V at "Logical 0";
- - of 2.2 - 10 V at "Logical 1".
g) Analog devices of millivolts scale in the form of thermometers with
resistance from 0 to 200 ohm to be chosen with agreement of TsSKB.
The sensors are interrogated by TMS with the current of no more than
3.2 mA.
h) Analog devices of millivolts scale in the form of thermocouple with the
output signal of 0 - 500 millivolts.
The sensors are interrogated by the system with the current from 0 to 20
microamp.
3.4.5 Sensor output device general requirements are the following:
а) Output signals are relayed from sensors with respect to common wire
which is galvanically disconnected with the S/C ground and ±27V system power
circuits. The connection of common measuring wire with the S/C ground shall be
realized from TMS side.
b) TMS provides protection of system inputs from voltage overload in the
range from minus 1V to plus 10 V and protects 6.25V and 5V sensors power sources
from overcurrent.
c) Under any conditions (including emergency) TMS limits delivery of voltage to output circuits of sensors under control in the range from minus 1V to plus
10 V.
d) Total inaccuracy of sensor measurement (in voltage measuring scale) between the TMS inputs and inputs of data processing devices shall be 1.0% at circuit
output resistance of no more than 1 kOhm and total capacitance of line of no more
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than 3000 pF. Increase of output resistance in more than 1 kOhm leads to increase of
measuring inaccuracy up to 0.2% per every complementary kiloohm.
e) Total inaccuracy (in millivolts measuring scale) shall not exceed 3%.
f) If necessary (to be agreed with TsSKB), galvanic connection of negative
polarity of circuit output with the S/C ground is allowed, increased inaccuracy of
TM parameters monitoring is possible.
g) Combination of circuit negative polarities of the same type is allowed with
outputs to dubbed connection contacts.
h) Particular sampling frequencies of TM monitoring shall be determined at
initial data delivery phase, proceeding from 0.7 and 1.4 Hz at data storing and 50 Hz
at data transmission in real time scale.
Sampling frequency of temperature parameters shall be no less than 0.01Hz.
i)
Interrogation pulse duration (readings of circuit output devices) shall
be:
approximately 78 µsec. for analog parameters;
approximately 78 µsec. for discrete parameters;
approximately 5 msec. for temperature parameters (analog and millivolts).
j) Input resistance of measuring channels shall be:
not less than 1MOhm for analog parameters;
not less than 10 kOhm for discrete ones.
3.4.6 Depending on the ground processing capabilities, it is permissible to
form telemetry parameters of the following types using the sensors specified in item
3.4.4: functional, signal, coded.
The functional ones are the telemetry parameters, which are formed by a), b)
types of analog sensors (ref. item 3.4.4).
The signal ones are the telemetry parameters, which are formed by c), d), e)
types of discrete sensors (ref. item 3.4.4).
The coded ones are the telemetry parameters, which are formed by the combination of either c), or d), or e) types of discrete sensors (ref. item 3.4.4.) in N-bit
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code presentation.
Programmed telemetry data (TM) stand for coded data formed by the S\H
computing facilities.
3.4.7 Coded parameters are presented in the TMS in a form of parallel numerical code. The certain code value shall be compliant with a definite measurable
physical value of the parameter or the S\H status.
3.4.8 The S\H programmed TM is the subarrays (packets) of sequential
“words”.
Each “word” is formed by N-bit parallel code.
Data packet incorporates reserved and information words. If a packet has an
odd number of “words”, it will be supplemented up to even number with a “word”,
all bits of which has “0” value.
Reserved words shall contain:
beginning-of packet marker (constant) (ААААh);
packet sequential number (from the start of the S\H functioning);
packet generation time;
end-of packet marker (constant) (5555h) (recommended).
Information words contain event control items and functional items of monitoring of the following physical processes:
signal;
coded-signal;
coded-functional.
Parameters with smaller length than a “word” has or equal to it shall be located in one “word”.
To form programmed TM data, the following code types shall be used:
binary code without signs;
binary code with signs;
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binary-decimal code without signs;
binary-decimal code with signs;
hexadecimal code.
If a packet has the changing set of items, it shall have the parameter, which
determines the type of changing part (e.g. number of experiment, operation mode.
etc.)
The S\H TM shall be stored in the internal memory of the S/H. Data transmitted in each communication session shall not exceed 2400 “words”.
Stored data is delivered to the output register from the S\H internal memory
device by command of the S\C control system.
During the process of delivering each “word” shall be kept at the register for
0.1 sec. Time for a “word” shift at the register shall not exceed 0.01 sec.
At data delivering to the output register the S\H internal memory shall not be
zeroed, the new data storage shall be continued with the preemption of the old one.
Data delivery to the output register shall begin with the latest stored packet. Data delivery shall be stopped according to the S\H internal program after full scope of information transmission.
When test operations of the S\H as a part of the S/C are finished, the possibility of memory zeroing shall be foreseen.
3.4.9 The S\H telemetry register can have 8, 16 or 32 bits. In every “word” the
most significant bit is a marker of the “word” shift at the S\H output telemetry register. In case of reasonable necessity, a high-order odd bit may be complimented to a
marker of a shift “word”. In the first “word” of packet the shift marker shall have
“1” value.
In organizing of the data delivery to the TMS it shall be taken into account
that:
to provide the true measured values of the analog sensor signals it is
necessary to make 4 -5 value interrogations in both DT and storage
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modes;
to provide the true measured values of the discrete sensor signals (signal and coded parameters), the duration of its unchanged state shall be
no less than 0.05 – 0.1 sec. in the DT mode, and no less than 1.8 – 3
sec. in the storage mode.
3.4.10 The S\H recommended output devices circuits are given in Annex E.
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Формат А4
3.5.
NOISE IMMUNITY AND NOISE GENERATION REQUIRE-
MENTS
3.5.1. The S\H shall be operable if the following external disturbances in the
power buses occur:
а) Single drops and jumps of the power supply voltage with a slope duration
of no less than 5 microsec. and an amplitude within the limits of the power supply
voltage (8 V), not often than twice per every 90 minutes.
b) Periodical pulse drops and jumps of the voltage of rectangular shape (pulsing ratio not more than two), within the limits of the power supply voltage, with an
amplitude of up to 5 V, a frequency of 20 kiloHz and a slope duration ( f), ( sec) of
no less than 10 microsec.
c) Switching noise with an amplitude of up to 10 V, a duration of the oscillation bursts up to 5 millisec., with periods of oscillation bursts not less than 0.1 sec,
the noise source is not more than 50 ohm.
d) Single voltage pulses of positive and negative polarities between the power
buses with respect to the ground with an amplitude (U noise) up to 150 V, a duration
up to 3 microsec. at a noise level of 0.5 U, with an internal resistance of the noise
source not less than 500 ohm.
e) Simultaneous occurrence of different switch noise disturbances (p. 3.5.1.c)
and noise disturbances specified in pp. 3.5.1.a) and 3.5.1.b) is allowed.
Some typical values for the power supply and the cabling are:
internal resistance of the power supply (R int.p.s) is from 0.01 to 0.1
ohm;
inductance of power supply (L p.s.) is from 10 to 20 microhenry;
and with a frequency of oscillation from 0.05 to 50 MHz. The internal resistance of
on-board cable system resistance (ROCS) is from 0.03 to 1.1 ohm;
on-board cable system inductance (LOCS) is from 10 to 30 microhenry.
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Формат А4
3.5.2. At the input power supply circuits the S\H may produce noise of any
kind with an amplitude of no more than 0.3 V.
3.5.3. Technique of noise immunity and noise generation testing shall be further agreed with the S\C developer.
3.6.
ELECTROMAGNETIC COMPATIBILITY REQUIREMENTS
3.6.1. The S\H shall not produce radio-noise fields with higher intensity than
values specified in Table 1.
Table 1
Radio-noise field intensity
levels, dBµV/m
from 0.009 to 0.15 inclusive
from 61 to 36
from 0.15 to 30 inclusive
from 37 to 20
from 30 to 100 inclusive
from 36 to 25
from 100 to 1000 MHz inclusive
from 25 to 45
The distance between the radio-noise source and measuring antenna
at radio-noise field intensity measurement is 1 m. (for data given in Table 1).
Nominal bandwidth of radio-noise meter (at minus 6 dB level) shall
correspond to the following values:
Frequency range, MHz
0.2 kHz in the frequency range from 9 to 150 kHz;
9 kHz in the frequency range from 0.15 to 30 MHz;
120 kHz in the frequency range from 30 to 1000 MHz.
3.6.2 The S\H installed inside the BION-M modules shall keep its operability
under the influence of noises specified in Table 2.
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Формат А4
Table 2
Noise type
Frequency range
Noise values
Magnetic field,
dBµА/m (А/m)
from 0.1 kHz to 100 kHz
120 (1)
Electric field,
dBµV/m (V/m)
from 1 kHz to 1 GHz
120 (1)
Electromagnetic field,
dBW/m2 (W/m2)
from 1 GHz to 20 GHz
-26 (0.0025)
Note – The S\H shall be resistant to the constant magnetic field with intensity
of 400 A/m in any direction.
3.6.3 The S\H installed outside the BION-M spacecraft shall keep its
operability under the influence of noises specified in Table 3.
Table 3
Noise type
Frequency range
Magnetic field,
dBµА/m (А/m)
from 0.1 kHz to 100 kHz
Electric field,
dBµV/m (V/m)
from 10 MHz to 1 GHz
Electromagnetic field,
dBW/m2 (W/m2)
from 1 GHz to 20 GHz
Noise values
120 (1)
146 (20)
0 (1)
Technique of electric and electromagnetic field tolerance testing shall be agreed
with the S/C developer.
3.6.4 Relative level of undesirable radio transmitter emission shall not exceed
the values given in Table 4.
Table 4
Relative-emission level
At harmonics up to 3 fр
minus 70 dB
At harmonics higher than 3 fр
minus 80 dB
Other kinds of side emissions
minus 80 dB
Noise emission level before the first harmonic
(subharmonic)
minus 80 dB
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Формат А4
Emission power at frequency range of 1200 – 1620 MHz shall be less than
minus 140 dBW (the radio-noise meter bandwidth is 500 kHz).
Noise emission level shall decrease according to the formula:
80
f
fP
2
80
fP
f
2 8 для f P
P
6 для f P
f
, dB
f
where f - current frequency, Hz
fP- radio-transmitter operating frequency, Hz
Relative frequency instability shall be not worse than 10-7%.
Amplitude selectivity shall be no worse than the values indicated in Table 5.
Table 5
adjacent-channel selectivity
70 dB
image-channel selectivity
90 dB
spurious-response selectivity
90 dB
blocking and cross-modulation factor
90 dB
intermodulation selectivity
90 dB
Spurious-response selectivity with the receiver susceptibility of less than minus 140
dBW is calculated according to the formula:
Q
90
H 140 , dB
where Н – receiver susceptibility, dBW
Technique of radio-electronics performance approval shall be agreed with the
S/C developer.
The designer of radio-electronics shall provide with a full scope of characteristics in a form given in Annex H.
The foreign radio-electronics developers shall provide the S/C developer
with a publication of frequency assignment from International Frequency Circular (IFIC).
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Формат А4
4. HEAT EXCHANGE REQUIREMENTS
4.1 The S\H total average daily heat release to gaseous environment shall be
no more than 450 W, taking into account heat release of bioobjects.
For devices with built-in fans, the gas temperature at output may exceed gas
temperature at input by no more than 5°С.
The density of heat flow on heat-exchange surface of each S/H unit on thermal control system thermal plates in the re-entry capsule, inside and outside service
module shall be no more than 800 W/m2.
4.2 In technically substantiated cases, for the S/H installed at detachable platform an autonomous thermal control system (TCS) can be designed. TCS maintains
temperature of spacecraft structure at the S/H installation site in the range from minus 50 to plus 50°C.
Allowable density of heat flow per unit of heat-exchange surface will be spe-
cified at TCS designing phase.
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Формат А4
5 OPERATIONAL REQUIREMENTS
5.1 STORAGE
The S\H in a standard package or in the S\C complement is stored in the
heated warehouses under the following conditions:
air temperature from 8 to 25 С;
relative humidity of no more than 80 %;
ambient pressure outside the S\C and the S\H package - (100 6.7) kPa
((750 50) mm Hg)
ambient pressure inside the S\C pressurized modules from 84.0 to
117.3 kPa (from 630 to 880 mm Hg).
Note – The increase of temperature up to 35 С, and indoors relative humidity
up to 90% is allowed (the total time of temperature or humidity increase is no more
than 60 days per each year of storage).
5.2 TRANSPORTATION
5.2.1 The S\H transportation in the S\C complement or in a standard package
to the space range is performed under the following conditions:
air temperature from minus 40 to plus 50 С;
air pressure inside the S\C pressurized modules from 70.7 to 152.0 kPa
(from 530 to 1140 mm Hg);
air pressure outside the S\C and the S\H package - (100 6.7) kPa
((750 50) mm Hg);
relative humidity inside the S\C pressurized modules of no more than 80%;
relative humidity outside the S\C of no more than 80% (absolute humidity
of no more 19 g/m3);
relative humidity outside the S\H package of no more 100%.
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Формат А4
5.2.2 The S\C transportation to the leak-tightness test conduction and back to
the fueling station (FS) (transportation time in one direction is no more than 2.5
hours) shall be performed under the following conditions:
air pressure outside the S\C (100 6.7) kPa ((750 50) mm Hg);
relative humidity of no more than 80%;
helium concentration in air inside the S\C tight modules of no more than
0.01
of volume.
5.2.3 The S\C transportation with the S\H onboard in the complement with the
launch vehicle (LV) to the launch pad (LP) and backwards in case of cancelled
launch shall be performed under the following conditions:
air temperature outside the S\C from 8 to 30 С;
air temperature inside the re-entry capsule from 18 to 28 С;
air temperature inside the service module from 8 to 30 С;
air pressure outside the S\C (100 6.7) kPa ((750 50) mm Hg);
ambient pressure inside the S\C pressurized modules from 89.1 to
114.4 kPa (from 670 to 860 mm Hg);
helium concentration inside the S\C pressurized modules of no more than
0.01
of volume.
5.2.4 The conditions of the S\C transportation with the S\H onboard in the upper composite (UC) complement from the S\C processing facility to the LV
processing facility correspond to the conditions listed in p. 5.2.3.
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Формат А4
5.3 THE S\C ASSEMBLY AND TESTING PROCEDURES
5.3.1 The S\H assembly (disassembly) and tests at the S\C processing are performed in the houses of the S\C producer-factory and the space range processing facilities under the following conditions:
air pressure - (100 6.7) kPa ((750 50) mm Hg);
relative humidity of no more than 80%.
Notes:
1. Average daily temperature variation is no more than 10 С.
2. At electrical testing the air temperature inside the S\C modules shall be
from 8 to 40 С.
temperature inside the RC shall be from 17 to 28 С.
5.3.2 The leakage testing of the S\C tight modules shall be conducted using
helium-air mixture pressure boost with the helium concentration of no more than 5%
of volume, with excessive pressure of 0.5 kgf/sm2 (49.1 kPa). Total time of the S\C
modules staying in the helium-air environment shall be no more than 40 hours (for
20 hours at the S\C producer-factory and in the space range processing facility).
When the testing is finished, helium shall be removed from the S\C pressurized
modules up to concentration of no more than 0.01% of volume.
The conditions for the S\H accommodated:
а) inside the pressurized modules there are:
3. After installation of the S\H with bioobjects in the re-entry capsule the air
helium-air mixture pressure of no more than 147.2 kPa (1.5 kgf/sm2);
helium-air mixture relative humidity of no more than 80%;
rate of air pressure change of no more than 1.33 kPa/sec (10 mm Hg/sec);
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Формат А4
helium-air temperature corresponds to the air temperature indoors;
б) outside the S\C there are:
air pressure of no less than 0.13×10-6 kPa (1.0×10-6 mm Hg);
rate of air pressure change of no more than 1.33 kPa/sec (10 mm Hg/sec);
air temperature corresponds to the air temperature indoors.
5.4 LAUNCH PAD OPERATIONS
Launch pad conditions are:
air temperature outside the S\C from 8 to 30 С, possible temperature variation is from minus 30 to plus 50 С for a time period of no more than 3 hours;
air temperature inside the re-entry capsule from 17 to 28 С;
air temperature inside the service module from 8 to 30 С, possible tempera-
ture variation is from 0 to 40 С for a time period of no more than 3 hours;
air pressure outside the S\C (100 6,7) kPa ((750 50) mm Hg);
air relative humidity of no more than 80%;
helium concentration in air inside the S\C pressurized modules of no more
than 0,01
of volume.
Notes – Time of staying at launch pad is no more than 36 hours (Precise time of the
S\C staying at the LP shall be determined at the subsequent phase).
5.5 INJECTION (FLIGHT IN THE LV COMPLEMENT)
Rate of pressure decrease outside the S\C is no more than 2 kPa/sec (15 mm
Hg/sec), and besides, in 3 sec. the rate of pressure decrease outside the S\C reaches
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Формат А4
8.5 kPa/sec (64 mm Hg/sec).
Dynamic pressure at the moment of shell separation from nose fairing of assembly-protecting unit (APU) shall be 19.6±19.6 Pa (2±2 kgf/m2).
5.6 ORBITAL FLIGHT
5.6.1 The S\H accommodated inside the S\C pressurized modules shall keep
its operability under the following conditions:
air temperature in the re-entry capsule is from 17 to 28 С;
air temperature in the service module is from 0 to 40 С;
air pressure in the re-entry capsule is from 88.9 to 127.9 kPa (from 660 to
960 mm Hg);
air pressure in the service module is from 46.7 to 151.987 kPa (from 350 to
1140 mm Hg);
air relative humidity is no more than 80%;
helium concentration in air inside the S\C pressurized modules is no more
than 0.01
of volume.
5.6.2 The S\H accommodated outside the S\C shall keep its operability under
the following conditions:
ambient pressure is no less than 0.13·10-9 kPa (1.0·10-9 mm Hg);
temperature is from minus 150 to plus 125 С.
5.6.3 Air content in the re-entry capsule shall be regulated by means of the
S\C life support system. Air content parameters shall be determined for the flight of
each S\C.
5.7 THE S\C FLIGHT TERMINATION
5.7.1 The S\H accommodated inside the re-entry capsule shall keep its operability under the following conditions at the phase of re-entry and landing of capsule:
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Формат А4
air temperature is from 10 to 30ºС;
air pressure is from 88.9 to 127.9 kPa (from 660 to 960 mm Hg);
air relative humidity is no more than 80%;
helium concentration in air inside the re-entry capsule is no more than
0.01
of volume.
5.7.2 The S\H shall be under the following conditions after the re-entry cap-
sule landing (during 24 hours):
air temperature outside the re-entry capsule shall be from minus 40 to plus
45 С;
air pressure shall be (100 6.7) kPa ((750 50) mm Hg);
air relative humidity inside the re-entry capsule shall be no more than 80%;
air relative humidity outside the re-entry capsule shall be no more than
100%;
air temperature inside the re-entry capsule shall be from 15 to 35 С, if
air temperature outside the re-entry capsule is from 10 to 30 С. Air temperature inside the re-entry capsule without the indicated range depends on the landing conditions, the date of landing of the re-entry capsule and the S\H heat release.
5.7.3 The S\H accommodated inside and outside the re-entry capsule shall be
under the following conditions during transportation from the landing site to the S\C
producer-factory:
air temperature shall be from minus 40 to plus 45 С;
air pressure shall be from 20 to 106.7 kPa (from 150 to 800 mm Hg);
air relative humidity shall no less than 100%.
5.7.4 After the re-entry capsule delivery to the S/C producer-factory the S\H
shall be under conditions specified in p. 5.3.1.
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Формат А4
5.8 VIBRATION, SHOCK AND ACOUSTIC ACTIONS
5.8.1 At operating in the S/C complement the S\H is subjected to:
а) low frequency random vibrations and shocks along each of three mutually
perpendicular axes during transportation in the S/C complement. Vibration and
shock parameters are given in Tables 6 and 7.
Table 6 – Random vibration levels at transportation
Frequency sub-range, Hz
Number
of mode
2-5
5-8
8-15
15-30
30-40
40-60
Duration of vibrations T, h
1
Vibroaccelerations spectral density S, g2/Hz
0.015 0.006 0.008 0.012 0.005 0.0005
2
0.003 0.004 0.002 0.0015 0.0025 0.0005
75
3
0.001 0.002 0.001
35
0.001
0.002
0.0005
30
Note – S and T values given in Table are allowed to consider along the axis with a
maximum sensitivity of the instrument, chosen by the S\H developer. Spectral
density S' and duration of vibrations T' along the other two axes are as follows:
S'=0.5 S, T'=0.3 T
Table 7 – Shocks during transportation
Amplitude of shock
accelerations, g
Duration of shock accelerations, msec.
Number of shocks
3
20 – 130
500
The S\H compliance to the conditions of mechanical loading during transportation in the S/C complement is allowed to confirm by testing operations according
to the modes specified in Table 8. The S\H and its components failure at testing operations according to Table 8 shall not be considered as a sign of discard. In this
case, retesting shall be done according to Tables 6 and 7.
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Формат А4
Table 8 – Modes of accelerated tests to be conducted in case of transportation in the
S/C complement
Number of
Amplitude of
Number of shocks along shocks per
Duration of shock
shock acceleeach of the three mutualminute,
accelerations, msec
rations, g
ly perpendicular axes
(not exceeding)
9
5 – 10
2500
120
b) linear (static) accelerations
Flight linear (static) accelerations levels along each of three mutually perpendicular axes at all phases of the S/H operation are given in Table 9.
Operational phases:
I
– injection (flight in the LV complement);
II – orbital flight;
Table 9 – Flight linear (static) accelerations levels
Operational phase
Acceleration, g
I
4.5
Duration of accelerations in
every direction along each axis,
sec
600
II
0.1
1000
0.5
50
12.5
20
6.0
100
III – deceleration, re-entry and landing.
III
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Формат А4
c) vibrations.
Flight sinusoidal vibrations levels along each of the three mutually perpendicular axes at all phases of the S/H operation are given in Table 10 and broadband
random vibrations levels – in Table 11.
Table 10 – Flight sinusoidal vibrations levels
Operation
phase
Frequency sub-range, Hz
Mode
number
5-10
10-20
20-40
1
Vibroaccelerations amplitude, g
0.5-1.0 1.0
1.0
1.0
2
0.5-1.0
1.0
1.0-1.5
1.5
120
1
-
-
0.2
0.2
120
2
-
-
0.5
0.5
120
1, 2
-
-
0.5
0.5
120
I
II
III
2-5
Duration of vibrations
along each frequency
sub-range, sec
120
Notes:
1. Mode 1 – for the S/H mounted on the S/C external surface and on the instrumentation plates.
2. Mode 2 – for the S/H mounted on the cantilever structural elements.
3. The variation of the vibroaccelerations amplitude according to frequency
within the sub-ranges of vibroaccelerations variable values is linear with a
logarithmic scale of frequency.
d) acoustic pressure.
Flight acoustic pressure levels for the S/H mounted on the S/C external surface at atmospheric flight phase of the S/C in the LV complement are given in Table
12.
Total root-mean-square level of acoustic pressure inside the S/C pressurized
modules in the range from 20 to 4000 Hz does not exceed 130 dB at duration of 60
sec.
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Формат А4
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Table 11 – Flight levels of random vibrations
№ докум.
Frequency, Hz
Operational Place of the S/H
phase
accommodation
20
50
100
200
500
2000
0.01
0.005
120
480
SM
0.005
0.005
Vibroaccelerations spectral density, g2/Hz
0.005
0.01
0.025
0.025
0.02
0.005
0.008
0.01
0.01
0.008
RC, SSP
0.005
0.005
0.005
0.005
0.01
0.008
0.025
0.01
0.025
0.01
0.01
0.008
0.005
0.005
120
480
II
SM, RC, SSP
0.0005
0.0005
0.0015
0.0015
0.0015
0.0015
0.0015
300
III
RC
0.002
0.002
0.002
0.002
0.002
0.002
0.001
180
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Duration of
vibrations,
s
I
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NOTE - Changes of the vibroaccelerations spectrum values between frequencies are linear with the logarithmic scale
of shock spectra and frequency.
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Формат А4
Table 12 – Flight acoustic pressure levels
Center frequency of octave frequency sub-range, Hz
31.5 63
125
250 500 1000 2000
4000
Root-mean-square level of acoustic pressure, dB
129 134 138
138 137
130
122
Note – Minimal acoustic pressure value is 2
120
-5
Total rootDuration,
mean-square
sec
level of acoustic
pressure,
dB
143.5
60
Pa.
e) shocks actions.
Shock levels presented in a shock spectrum with a quality factor (Q=10) along
each of the three mutually perpendicular axes at the LV and the S\C pyrosystems
actuation are given in Table 13.
Single mechanical shocks levels along each of the three mutually perpendicular axes at functioning of soft landing engine and at the re-entry capsule landing are
given in Table 14.
sources of mechanical actions, the S/H operability under the indicated actions shall
be confirmed. Meanwhile, shocks levels acted on the S/C at the S/H attachment
points shall not exceed the values given in Table 15.
Table 13 – Flight shock levels at the LV and S/C pyrosystems actuation.
Frequency, Hz
Operation
phase
I
II
If the S/H has in its structure push-type actuators, pyro devices and others
III
50
1000
2000
5000
Shock spectrum value, g
10 1000 1000
800
10
500
500
300
5
350
350
200
15 1200 1500 1500
10 1000 1000
800
10
500
500
300
15 1200 1500 1500
10 1000 1000
800
10
500
500
300
Place of the S/H mounting
SM
SM
RC, SSP
RC
housing plate
housing
plate
Quantity of shocks
2
3
5
2
2
1
1
1
3
4
4
4
2
1
3
2
4
5
5
8
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Формат А4
Notes:
1. Changes of the shock spectrum values are linear with the logarithmic scale
of shock spectra and frequency.
2. Shock spectrum values given in table are determined at the S/H installation
at the distance of l
0.5 m from pyrosystems (according to the S/C struc-
ture). Depending on the particular S\H arrangement in the S/C shock spectrum values can be specified, if necessary.
Table 14 –Shocks at functioning of soft landing engine and at landing
Shock acceleDuration of shock
Quantity of
ration
acceleration, msec
shocks
amplitude, g
1
5-10
5
40
III
2a
20-40
1
90
2b
20-40
1
40
Note –2а mode is for the S\H structure and its attachment points.
Operation
phase
Number
of mode
Table 15 – Shock levels permissible for the S/C
Frequency, Hz
50
1000
2000
5000
Shock spectrum value, g
10
500
500
300
Note – Changes of the shock spectrum values between frequencies are linear
with the logarithmic scale of shock spectra and frequency.
Notes:
1.
In present document vibrational, shock and linear acceleration values
are set in g units that proportional to the Earth gravitational acceleration. If it is necessary to use m/sec2 units for mechanical action parameter, then acceleration values
given in g units shall be multiply by 9.81 m/sec2.
2.
If there are no test facilities for random vibration testing, it is allowed to
confirm the S/H operability by equivalent harmonic (sine) tests with the vibroacceleration amplitude in accordance to the following formula:
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Формат А4
n 3
F
S,
2Q
n – sine vibration amplitude, g;
where
Q – quality factor of the S\H structural elements;
S – spectral density of the vibroacceleration, g2/Hz;
F – frequency, Hz;
=3,14.
3.
Modes of mechanical actions on the S/H given above are defined for at-
tachment points of the S/H to the S/C at anti-deflection mounting or to the
“input” of the S/H amortizing devices. Acoustic actions modes are defined for
the S/H external surface.
4. Operational requirements specified above are given for a single operating
cycle.
5. The S/H shall function reliably under the conditions presented above. Specif-
determined according to the program of the S/H operation in the S/C complement.
5.8.2 The S/H qualification requirements.
In p. 5.8.1 there are operational requirements of the mechanical actions on the
S/H. During development and testing qualification levels of the mechanical actions
should be used. Qualification levels shall be defined by means of multiplying (increasing) mechanical action operational values given in p. 5.8.1 by the qualification
coefficients set by the S/H developer.
Recommended values of the qualification coefficients are given in Table 16.
ic requirements to strength, stability or immunity of the S/H to these actions are
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Формат А4
Table 16 – Qualification coefficients
Mechanical actions
Operational phase
I, III
II
I
II, III
I, II, III
I
Linear (static acceleration)
Sine vibration
Random vibration
Acoustic pressure
Qualification coefficient
1.3
1.5
1.3
1.5
2.0
+3 dB
При продолжительности акустического нагружения 120 с
Note – It is allowed to regard vibrational (during transportation) and shock levels on
the S/H given in Tables 6, 7, 13, 14 as qualification levels.
5.9 RADIATION EXPOSURES
The S/H shall keep its reliable operability during the S/C active life under the
natural ionizing space radiations (ISR) exposure on it, namely proton and electron
radiations of natural Earth radiation belts (NERB) and proton radiation of solar cosmic rays (SCR) with the levels given in Table 17.
Table 17 – Levels values of natural ISR absorbed doses effecting on the S/H.
Place of the S/H accommodation
outside
behind thermal insulation (ЭВТИ-ВВ-30)
Х,
g/sm2
0.01
0.03
Dе NERB,
rad
7540.00
2580.00
Dр NERB,
rad
267.00
Dр SCR,
rad
4540.00
95.20
2010.00
inside SM
0.80
9.49
10.40
58.80
inside RC
2.00
0.24
6.94
24.80
Note – The levels in Table are given basing on “flat screen” model of the S/H protection.
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Формат А4
The S/H and its components mounted on the S/C external elements (e.g. antenna cables) are subjected to ISR exposure with the following levels (according to
the spherical screen):
Dе NERB =2.76 104 rad,
Dр NERB =9.08 102 rad,
Dр SCR =1.82 104 rad.
The S/H mounted inside the re-entry capsule is subjected to -radiation exposure with a dose equal to 0.033 rad/24 hours ( -radiation dose value is defined at a
distance of 0.88 m).
6. STANDARD SCHEDULE OF WORKS CARRIED OUT WITH THE
S/H
6.1. GROUND CHECKOUT PROCEDURES OF THE S/H IN THE S/C
COMPLEMENT
and auxiliary equipment shall be delivered to Samara.
In order to take part in the S/C ground processing, the S/H with MDU, GSE
spection of the S/H shall be carried out. Incoming inspection shall be executed in the
The S/H ground checkout procedures consist of the following phases:
I. The checkout of the S/H at the producer factory;
II. The checkout of the S/H at the Baikonur space range (Processing Facility – PF).
Before testing procedures of the S/H in the S/C complement, the incoming in-
incoming inspection lab at the producer factory (Baikonur space range) to check the
S/H structural integrity and operability before its mounting inside the S/C. Incoming
inspection shall be carried out by the S/H developer by means of GSE and auxiliary
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Формат А4
equipment according to the incoming inspection manual of a particular S/H.
6.1.1 The S/H checkout procedure at the S/C producer factory.
At the S/C assembly stage the following procedures shall be carried out at
the producer factory:
checkout of the mechanical interface between the S/H and the S/C;
the S/H mounting inside the S/C;
determination of the mass actual values and center-of-mass position
of the re-entry capsule and the S/C.
Indicated procedures can be carried out with the mass dummy units of the
S/H. In this case mounting of the flight model of the S/H shall be carried out before
the S/C electrical testing. Flight model of the mass dummy unit should replace flight
model of the S/H on board of the S/C, if it is not delivered to PF.
At the S/C electrical testing stage the following shall be carried out at the
producer factory:
the S/H functioning (the checkout of the electrical interfaces with the
S/C (power supply, control, TM data, TM data structure and its logic);
the S/H participation in all kinds of the S/C combined testing;
checkout of non-impact of the S/C operating systems on the S/H.
To control “false” commands passing to the S/H, GSE should provide:
- logging of command passing;
- logging of time of command passing;
- possibility of time zeroing;
- possibility to set the S/H in initial state.
The S/H electrical testing at the producer factory and at the Baikonur space
range shall be carried out by means of GTF and the S/H GSE. The S/H shall be connected to GTF directly through the S/C OE.
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Формат А4
The S/H functional testing at the producer factory and at the Baikonur space
range shall be carried out by means of the S/C TMS and the S/H GSE.
The logging of TM data to magnetic tape shall be carried out by ground station.
The S/H developer shall participate in all kinds of electrical testing.
After the S/C electrical testing termination the S/C compartments with the
S/H installed shall be leak tested in a pressure chamber.
When the S/C testing procedures at the producer factory are finished, the S/H
shall be rail transported from Samara to Baikonur space range in the S/C complement or separately from the S/C.
Note – The S/H needed to be loaded at the manufacturing place shall be dismantled from the S/C, packed up in the shipping container and sent to the S/H developer in order to carry out loading operations.
At the Baikonur space range the following kinds of operations with the S/H
are foreseen:
the S/H functional tests (checkout of the electrical interfaces with the
S/C);
the S\H participation in all kinds of the S/C combined tests;
6.1.2 The S/H checkout at the Baikonur space range.
the S/H participation in leak testing of the S/C compartments in
pressure chamber;
final operations (the loading of the S/H with bioobjects, etc.).
electrical interfaces checkout of the loaded S/H according to reduced
program.
Note - The S/H loaded at the manufacturing place shall be delivered to the
Baikonur space range by the S/H developer. The S/H shall be subjected to the incoming inspection procedure, then it shall be installed inside the S/C and electrical
tests shall be carried out in full or reduced form.
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Формат А4
Preliminary technological schedule of operations to be carried out with BIONM launch vehicle system at the Baikonur space range is given in Annex I.
6.1.3 Operations to be carried out at the RC landing site and postflight servicing
At the RC landing site (LS) the S\H shall be extracted from the re-entry capsule and handed to the S/H developer.
The S/H, which shall not be dismantled, is transported by air in the RC complement to the S/C producer factory, where it shall be dismantled and handed to the
developer.
Time of the RC search does not exceed 24 hours after its landing.
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Формат А4
7. RELIABILITY REQUIREMENTS
7.1. In case of the S/H failure, the S/C shall not be damaged, it shall keep
normal operability.
7.2. Failure effects criticality analysis (FUECA) should be carried out (according to State standard 27.310 - for the developers of Russian S/H, IEC-812 - for
European developers of the S/H, MIL STD 1629 - for USA). This analysis should
be presented in Reliability Plan (RP).
7.3. The S/H shall have warranty life time ensuring its operation in the S/C
complement.
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Формат А4
8. SAFETY REQUIREMENTS
8.1 The S/H safety shall be guaranteed by the design concepts, operational
technologies at ground testing stage and operational documentation.
8.2 The S/H shall be fire and explosion-proof to self E-field radiation, high
frequency signals and isotopic radiation, shall not represent danger for the S/C and
the service maintenance staff.
8.3 Materials used in the S/H shall not exude toxic substances.
8.4 Metallization of the S/H and grounding of the S/H test equipment should
be done in accordance with State standard 19005-81 (for Russian S/H).
8.5 Removal of static electricity from the S/H cables before their connection
to microelectronic devices should be done in accordance with Industry standard 92-
1615-74 (for Russian S/H).
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Формат А4
9 GROUND SUPPORT EQUIPMENT REQUIREMENTS
9.1. In order to carry out the S/H incoming inspection and autonomous tests
at the S/C producer factory and to enable the participation of the S/H in the S/C tests,
Ground Support Equipment (GSE) shall be provided ensuring the following capabilities:
power supply to the S/H;
control commanding;
monitoring the execution of commands;
logging of command forwarding time;
possibility of time zeroing;
possibility of the S/H setting into initial state;
monitoring the parameters which characterize the S/H operability.
9.2. The GSE shall include the cabling which connects it to the S/H during
autonomous tests and when it participates in the S/C tests.
9.3. Conditions of the GSE operability shall meet the requirements of the
S/H operation during ground testing presented in section 5 of this document.
The GSE shall be plugged into a power supply source of 220 V, 50 Hz.
9.5. In order to protect the GSE from static discharge, the S/H shall be
equipped with bonding studs and wires.
9.6. The GSE operating manual shall be provided together with the S/H
GSE. Operating Manual shall include information about area needed for the GSE
and the S/H placement.
9.4.
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Формат А4
10 STORAGE, PACKING AND MARKING REQUIREMENTS
10.1. Packing of the S/H and its SP (Spare Parts) as well as the GSE and its
SP shall protect the S/H from exposure of weather factors specified in section 5 of
this document.
10.2. The S/H and its SP as well as the GSE and its SP shall be stored and
transported in shipping containers.
10.3. The markings of the S/H instruments shall be done on the case of each
instrument and shall be accessible and convenient for reading.
The marking shall be done in conformity with OD. It shall contain:
name of the instrument;
index of the instrument;
10.4. The connectors’ numbers shall be engraved on their cases so that the
number was accessible for reading and was in vicinity of the connector attachment
point into a working position. The marking of connectors shall be done in conformity with the marking in OD.
10.5. The marking at the connectors shall not be same as the marking on the
instrument.
10.6. The marking of cabling shall be done on each cable in conformity with
documentation.
serial number of the instrument.
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Формат А4
11 WORK STEPS, DOCUMENTS TO BE SUBMITTED
11.1. Development, production and operation of the S/H and its components
shall be performed according to the following steps:
draft design;
operational documentation development;
production of the S/H and Mass Dummy Units prototypes;
production of Flight Models of the S/H;
acceptance testing;
autonomous testing of the S/H;
electrical testing of the S/H in the S/C complement;
flight operation;
the S/H postflight handling.
11.2. The S/H developer shall submit and coordinate the following documentation:
THE S/H INITIAL DATA
The S/H initial data shall include:
1)
name of the equipment, its purpose, list of units (including cables) with
their mass performance data;
2)
main technical characteristics of the S/H;
3)
physical configuration (appearance) of the S/H with overall dimensions;
4)
description of hardware and its components, its functioning;
5)
description of special requirements for the S/H units installation, includ-
ing manipulator operation requirement;
6)
information about volume-mass-c.g. position simulators if the delivered
instruments are unloaded
7)
functional logics and the S/H operation program;
8)
scope of work and sequence of operations with the S/H at all stages: the
S/C ground prelaunch activities at the producer factory, in processing and launching
facilities as well as after flight finishing at the launch site of the re-entry capsule and
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Формат А4
postflight servicing;
9)
the S/H heat release data (heat release diagrams);
10) charts of power consumption with taking into account standard cyclograms of the S/H operation indicating power-supply circuits characteristics (voltage,
minimal, maximal and nominal currents, duration of peak current loads);
11) list of the S/H control commands and control circuit characteristics;
12) list of signals received by GTF, list of commands relayed by GTF. The
S/H is interfaced with GTF directly through the S/C OE;
13) general electrical diagram;
14) telemetry data circuits characteristics (output devices data, wire requirements);
15) information on electrical interfaces between the S/H and the S/C systems ( including arrangement of soldered connections), list of cables.
THE S/H OUTLINE DRAWINGS
The S/H outline drawings requirements are given in Annexes A and C.
1.
2.
3.
4.
Works execution conditions requirements.
Safety requirements.
List of necessary equipment and tools.
Scope of work and sequence of the S/H mounting/dismantling operations during ground prelaunch procedures at the producer factory, in PF and LP, after the S/C flight finishing at LS and at postflight servicing (list of operations, time
limits, etc.).
TELEMETRY MONITORING DATA
THE S/H MOUNTING/DISMANTLING INSTRUCTION
The S/H mounting/dismantling instruction shall contain:
Telemetry monitoring data shall contain:
a) list of the S/H TM parameters to develop measurement program;
b) initial data necessary for automated TM parameters processing;
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Формат А4
c) initial data necessary for the S/H functioning evaluation on TM parameters during the S/H participation in the S/C preparation to operation;
d) initial data necessary for the development of operation documentation on efficient evaluation of the S/H operation in flight by means
of TM data during the S/C flight;
e) logic of alteration of TM parameters;
f) method of monitoring;
g) symptoms of contingencies according to TM data and proposals on
its elimination;
h) mutually agreed form of TM data monitoring results presentation.
QUALIFICATION TESTS RESOLUTION
It shall be indicated in resolution that the tests with the S/H were conducted in
conformity with a well-rounded programme of research (WPR) and met the operational, safety requirements to the S/H given in accordance to this documentation and
Reliability Plan (RP).
Note – WPR and RP for the Russian S/H shall provided by the S/H developers
in accordance with Combined Operations Plan.
The S/H developer provides information (reports) about the S/H testing to
confirm operational and technical requirements, if necessary.
OPERATING MANUAL
The S/H operating manual shall contain the S/H operation instructions during
ground processing in accordance to requirements given in Annex F to the present
document.
FLIGHT CONTROL INSTRUCTION
Flight control instruction of the S/H shall contain: list of control commands,
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Формат А4
list of TM-parameters, the S/H operational logic, timeline of experiments conduction, contingencies, the symptoms of contingencies according to TM-parameters and
recommendation on their eliminations.
SERVICE LOG
Service logs for Mass Dummy Units and the S/H shall be done in accordance
with a form given in Annex G to the present document.
INCOMING INSPECTION MANUAL
The S/H incoming inspection manual shall contain:
1. Checking out procedures of the S/H mechanical and electrical interfaces.
2. Scope of checking out procedures of the S/H powered from GSE.
Incoming inspection of mechanical interfaces of Mass Dummy Units and
respective scientific hardware.
THE S/H TECHNICAL SPECIFICATION
Technical specification shall contain the description of the S/H nominal operation principle.
Flight Models of the S/H shall be carried out in conformity with outline drawing of
11.3 The S/H delivery set shall include:
Mass dummy units of the S/H or mass dummy units of equipment (if
necessary);
the scientific hardware itself;
Mass dummy units, scientific hardware and ground support equipment packing containers and auxiliary equipment;
packing lists inside of each container;
service log (passport);
operating documentation set.
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Формат А4
Annex A
(it is obligatory)
OUTLINE DRAWINGS REQUIREMENTS
The outline drawings of the instruments shall include:
1) Dimensions, which allow defining the instrument configuration.
2) Mass data (initial and finite values to be measured in the process of operation) with the following maximum deviations:
up to
10.0 % for mass no more than 0.5 kg,
up to
8.0 % for mass from 0.5 to 1.0 kg,
up to 5.0 % for mass from 1.0 to 3.0 kg,
up to 3.0 % for mass from 3.0 to 50.0 kg,
up to 2.0 % for mass more than 50 kg.
3) Location, coordinates and types of connectors, the position of keys for Russian connectors, marking of the connectors in conformity with the electrical dia-
gram, location of connector matching parts including cables bending radius for nonRussian connectors.
4) Coordinates and dimensions of the mounting seats (attachment points) with
tolerances, nonflatness with respect to the mounting seats plane shall be no more
than 0.2 mm.
5) Position of the instrument axes with respect to the axes of the S/C or the
note “G-loading direction is not important”.
6) Position of the instrument centre of mass with respect to attachment points
and mounting seats plane with maximum deviation including initial and final posi-
tions in case of its changing during operations.
7) Type, dimensions and maximal travel of shock-absorbers.
8) The arrangement and names of those units of the S/H, which require access
in the S/C complement.
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Формат А4
9) Indication of the extreme positions of the moving parts, which can change
the overall dimensions of the S/H.
10) Specific requirements to the location and installation of any unit: relative
position, field of view, directional diagram, accuracy, etc. (if necessary).
11) Position of the attachment points for transportation and installation, when
the mass of a unit is no more than 20 kg.
12) Inherent moments of inertia with maximum deviation along three axes, if
the mass of a unit is no more than 10 kg.
13) Position, coordinates, material and dimensions of bonding stud, “bonding
stud – instrument” intermediate resistance. The phrase: «To measure intermediate
resistance, the local removal of coating from housing is allowed with its further restoration» or to indicate a place without coating for intermediate resistance measuring.
14) Location and numbers of the technological elements to be removed during
the flight preparation.
15) Markings and their positions on the hardware.
16) The phrase: «When working with the hardware use the S/H mounting/dismantling manual [name, number]».
17) For instruments with built-in fans it is necessary to measure inputs and
outputs of vent holes, to indicate air flow direction and air consumption rate.
18) Location, marking and dimensions of air-, hydro-connectors, gas and fluid
flow directions.
19) Names, dimensions, mass and service zones of the parts of the instrument
to be removed and installed after unit mounting inside the S/C.
20) Material and coating of the instrument and attachment points.
21) Heat release and air temperature increase at the instrument outputs.
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Формат А4
22) Operating temperature range.
23) For instruments requiring heat extraction not to the gas environment, but
through the surface, it is necessary to indicate this surface, the name of it, dimensions, heat dissipation area, type of heat-conducting paste, heat flow density, maximal heat flow rate through this surface, irregularity of heat flow density.
For instruments to be installed outside the S/C it is also necessary to indicate the temperature mode of mounting seats plane, AS and ε coefficients of instrument surface and insulation applied on it.
24) For instrument to be accommodated outside the S/C, it is necessary to indicate places to be covered with insulation and the zones where application of insu-
lation is not allowed.
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Формат А4
Annex B
(it is obligatory)
The S/H mass dummy unit requirements
Mass dummy unit shall correspond to the Flight Model of the S/H in the following:
a) external envelops;
b) mass with deviation:
±5 % – for mass of the instrument no more than 3 kg and for cable of any
length,
±3 % – for mass of the instrument from 3 to 50 kg,
±2 % – for mass of the instrument more than 50 kg;
c) coordinates of centre-of-mass with deviation of ±5 mm;
d) rigging points structure;
e) attachment points structure including shock-absorbers;
f) structures changing its overall dimensions after installation inside the S/C;
g) electro-, air-, hydro- connectors and its arrangement on the instrument.
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Формат А4
Annex C
(it is obligatory)
Interblock cables outline drawings requirements
Cables outline drawings shall contain:
1) Layout of the cables with length indications.
2) Mass data with maximum deviations:
up to 20.0 % for mass no more than 0.2 kg;
up to 10.0 % for mass from 0.2 to 0.5 kg;
up to 8.0 % for mass from 0.5 to 1.0 kg;
up to 5.0 % for mass more than 1.0 kg.
3) Type and marking of connectors.
4) Cross-sectional dimensions.
5) Requirements to the mounting in the S/C complement (including possible
bending radius, distance between attachment points).
6) Connector dimensions necessary for attachment to the S/C (if necessary).
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Формат А4
Annex D
PCTB connector characteristics
D.1 Overall, installation and mounting dimensions of PCTB male plugs.
b
B
A
D
D1
4 apert. Ø d 1
A
B
Quantity of
pins
10
19
32
50
D
M14 х 0.75
М18 х 0.75
М22 х 0.75
М27 х 0.75
D1
d1
A
Dimensions, mm
М14 х 0.75 2.2
15
М18.х.1
2.2
18
М22 х 1
2.7 21.5
М27 х 1
3.2
26
B
b
20
24
28
33
1.4
1.4
1.8
2.0
Max
mass, gr
5.5
9.0
12.0
18.5
15,8 max.
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Формат А4
Pins arrangement scheme
РС10ТВ
РС32ТВ
1
2
1
2
3
1
РС50ТВ
7
4
10
5
8
13
11
17
3
5
14
19
18
25
6
8
20
25
26
33
10
9
30
26
31
32
34
40
46
41
47
50
48
49
РС19ТВ
2
3
4
7
8
12
13
16
17
18
19
Pin reference designation is given from
the mounting part of the male plug.
1
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Формат А4
D.2 PCTB connector electrical characteristics:
a) Connector operating voltage:
- U max. is no more than 200 V. (peak-reading);
- U min. > 1 mV.
b) Connector pin current:
- I max. < 4 Amp. (every second pin located along the perimeter will be
loaded with maximal current);
- maximal current load on other pins: РС10ТВ – 2.5 Amp, РС19ТВ –
1.5 Amp, РС32ТВ – 1.5 Amp, РС50ТВ - 1 Amp.
- I min. > 1 microamp.
c) Connector total current load: РС10ТВ - 24 Amp, РС19ТВ - 32 Amp,
РС32ТВ - 50 Amp, РС50ТВ - 60 Amp.
d) Wiring tails allow splicing of wires with maximal section of 0.5 mm2.
These connectors meet BION-M spacecraft operational requirements.
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Формат А4
Annex E. Recommended schemes of the S/H output devices
Table – Form of submitting output device circuits in scientific hardware.
Potentiometers or potential divider
+Umeas
+Umeas
+
Iint.
+
Electronic or other circuits with analog output signal with voltage from
0 to 6.25V
–
Rout ≤ 1 kilohm,
Iint = 5…20 microamp,
Umeas =6.25 V
–
+
output
device
Iint.
Rated characteristics of circuit connection of output device to TMS
Rout
Rout
Rout,Uout
Iint.
Rout ≤ 1 kilohm
(not more than 10 kilohm),
Uout. = 0…6,2 V,
Iint 5…20 microamp.
–
3 Discrete-parametric
devices Relay contacts,
switches, etc.
2 Analog-generating devices
1 Analog-parametric devices
Circuits of output device generating control parameter
Type of output
Circuit of output device
device
К
Im+ ea
Imeas. ≤ 0.6 mA permanently,
Ropen. (Log "0") ≤ 100 ohm,
Rclosed. (Log "1") ≥ 100 kilohm
s.
–
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Формат А4
a)
+Upow
Imeas. ≤ 0.6 mA
permanently to sensor,
Uout. open. (Log "0") ≤ 0.7 V,
Irev.col.cur. ≤ 50 microamp,
Rcol >> 10 kilohm,
Upow =3…10V
Imeas
+
Uout
–
b)
Imeas
+
Uout
5 Discrete-generating devices
Electronic or other circuit with discrete output
device with output resistance no more than
1kilohm
–
+
output
device
Rout,Uout
–
Imeas
Rout ≤ 1 kilohm,
Imeas. ≤ 0.6 mA
permanently to sensor,
Uout. (Log "0") = -1…0.7 V,
Uout. (Log "1") = 2.2…10 V
4 Discrete-parametric devices
Electronic switch (semiconductor) with collector
powered through resistor R>>10 kilohm or nonpowered collector
Type of output
device
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Формат А4
Iint
Iout. +
.
7,8 Analog-parametric devices
Thermometer, thermistor or other
register.
output
device
к.
Rinp.of TMS
Rout,Uout
–
+
Iint.
1 kilohm < Rout. ≤ 10 kilohm
Uout. (Log "0") = -1…0.7 V,
Uout. (Log "1") = 2.2…10 V,
Iout ≤ Uout/Rinput,
permanently to sensor
Iint. < 3.2 mA,
Rsens. ≤ 200 ohm
Rsens
–
Iint.
+Uout
–Uout
9 Analog-generating devices. Thermocouple or other
source of analog “millivolt”
signal
6 Discrete-generating devices.
Electronic or other circuits with discrete output
signal with output resistance of more than
1 kilohm, but no more than 10 kilohm
Type of output
device
+
=
Iint.
Iint ≤ 3.2 mA,
Rsens ≤ 200 ohm
Uout. ≤ 500 mV,
Iint. = 5…20 microamp
Uout
–
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Формат А4
Annex F
The S/H operational manual requirements
The S/H operational manual shall contain:
1. General directions for organizing activities including safety rules.
2. Sequence of post-storage and prestarting preparations of GSE with its
putting into a working condition.
3. Procedure of autonomous testing.
4. Sequence of participating in the combined testing.
5. Specific requirements.
6. Decoding (evaluation) of the S/H parameters.
7. Program of the S/H electrical testing in the S/C complement with the list
of control commands and TM-parameter functional diagrams.
8. Indication of the S/H GSE availability.
9. Requirements to the location of the GSE accessibility to its control eleПодпись и дата
ments and restrictions on the cabling and its length.
10.The GSE connection scheme.
11.Dimensions and mass data of the transportation containers for units.
12.List of consumables and their delivery sequence.
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Формат А4
Annex G
SERVICE LOG
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Формат А4
HARDWARE DATA
Index
Serial number
Manufacturing date
Guarantee term
Place of installation
Mass
Centre-of-mass position
CERTIFICATE
The hardware _________________ complies with the design specification
353П-12КС-31684-1103 (Appendix to Agreement_____________________)
and is certified for operation in BION-M № __ spacecraft complement.
Note – For Russian scientific hardware it is necessary to add note: «Manufactured in conformity with NA-99».
Design Manager _________________________
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Формат А4
RECORD OF OPERATIONS TO BE CARRIED OUT WITH
THE S/H
Date
Operation
Note
Special comments
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Формат А4
Annex H
Initial data of Radio-Electronic Devices (RED)
Routing
Access circuitry
Symbolic representation of emission class
Abstract of emission class specification
Measures of noise immunity growth
Symbolic representation of transmitter
Reference number of RED
Name of RED
Purpose of RED
Coverage area
Frequency range
Minimal boundary frequency
Maximal boundary frequency
Operating frequencies (nominal and formula)
Frequency spectrum pitch
Frequency tuning type
Modulation type
Modulation parameters
Parameter value
Coding type
Information rate
Emission bandwidth
at minus -3 dB level
Emission power (aver./puls./peak)
Minimal
Maximal
Maximal power spectral density
Minimal power spectral density
Side emission relative level
at harmonics up to 3f
at harmonics higher than 3f
Other types of emissions
Frequency relative instability
Type of output device (semiconductor/travelling-wave
tube/klystron)
Purpose of antenna
MHz
MHz
kHz
kHz
Hz, MHz, rad
Kbit/sec
(baud/sec)
MHz
kHz
MHz
dBW
dBW
dBW/Hz
dBW/Hz
dB
dB
dB
dB
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Формат А4
Type of transmitting antenna
Antenna size
Quantity of simultaneously generated beams
Characteristics of each beam
Name
Beam attitude
Frequency at which antenna measurements are carried out
Coefficient of amplification
Width of antenna diagram at minus –10 dB level
in horizontal plane
in vertical plane
Maximal side lobes level
Angles sector
Lobes level
Antenna pointing accuracy
Coverage area
Type of feeder
Cutoff frequency of AFP
Type of polarization
Coefficient of ellipticity
Polarization vector direction
Polarization vector inclination
AD
Symbolic representation of receiver
Reference number of RED
Name of RED
Purpose
Coverage area
Purpose of antenna (receiving, transmitting/receiving)
Type of receiving antenna
Antenna size
Quantity of simultaneously generated beams
Characteristics of each beam
Name
Beam attitude
Frequency at which antenna measurements are carried out
Coefficient of amplification
Width of antenna diagram at minus –10 dB level
in horizontal plane
in vertical plane
mm
MHz
dB
deg.
deg.
deg.
dB
deg.
MHz
deg.
Table, diagram or equations
mm
MHz
dB
deg.
deg.
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Формат А4
Maximal side lobes level
Angles sector
Lobes level
Antenna pointing accuracy
Coverage area
Type of feeder
Cutoff frequency of AFP
Type of polarization
Coefficient of ellipticity
Polarization vector direction
Polarization vector inclination
deg.
dB
deg.
MHz
deg.
Type of receiver
Receiver-noise threshold
Actual receiver sensitivity
Noise protection ratio
Type of noise
HFA bandwidth
at minus 3 dB level
at minus 30 dB level
IFA characteristics
№ and kind of heterodyne tuning control
IF value
IFA bandwidth
at minus 3 dB level
Frequency relative instability
Noise equivalent temperature
Possible increase of noise temperature
Dynamic range
Adjacent-channel selectivity
Image-channel selectivity
Other-channel selectivity (SRC)
Blocking selectivity, cross distortion selectivity
Intermodulation selectivity
Eb/No required signal-to-noise ratio
dBW
dBW
dB
MHz
kHz
kHz
1.
MHz
MHz
MHz
MHz
K
%
dB
dB
dB
dB
dB
dB
dB
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Формат А4
Annex I
Preliminary technological schedule of operations to be carried out with
BION-M launch vehicle system at the Baikonur space range
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
The S/C assembly in a test stand
Checkout of OCS
TCS filling
Electrical testing of the S/C and functional testing of the S/H
The S/C preparation to leak-tightness test and CPU fueling
The S/C transportation to pressure chamber
Leak-tightness test of the S/C
The S/C transportation to FGS
CPU fueling
The S/C transportation to the S/C MIK
Installation of the S/C in a test stand
Installation of BB in PM
Final electrical testing
Demounting of the S/C from a test stand and installation of it on a trivet
Installation of APU IB in a test stand
Installation of the S/C on the IB
Installation of piggyback payload
Installation of SB
Installation of the late access and loading S/H (to be finished 58 hours
before launch). Precise time of loaded S/H installation will be defined later.
20. Final operations
21. Assembly of UC
22. The S/C transportation to the LV MIK
23. Operations to be carried out in the LV MIK
24. Transportation to the LP
25. Operations to be carried out at the LP (i.e. the replacement of the S/C
process hatch cover by nominal one, if necessary)
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Формат А4
LIST OF ABBREVIATIONS
AD – antenna diagram
AFP – antenna-feeder path
APU – assembly-protecting unit
ATF – autonomous testing facility
BB –buffer battery
CPU – combined propulsion unit
DT – direct transmission mode
FGS – fueling ground station
GSE – ground support equipment
GTF – ground testing facility
HFA – high frequency amplifier
HRC – heat-resistance coating
IB – intermediate bay
IFA – intermediate frequency amplifier
IPS – independent power source
ISR – ionizing space radiation
LP – launch pad
LS – landing site
LV – launch vehicle
LVS – launch vehicle system
MD – memory device
MDU – mass dummy unit
MIK – integration and testing facility
MLI – multi-layer insulation
MMS – monitoring and measurement system
NERB – natural Earth radiation belt
OCS – on-board cable system
OD – outline drawing
OE – on-board equipment
OF – orbital flight
PC – programmed command
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Формат А4
PF – processing facility
PM – propulsion module
PSS – power-supply system of the S/C
RC – re-entry capsule
RED – radio-electronic device
RP – reliability plan
SB – solar battery
SC – single command
SCR – solar cosmic rays
SM – service module
SP – spare parts
SRC – side receive channel
SSP – separation system platform
S/C – spacecraft
S/H – scientific hardware
S/H PTMD – scientific hardware programmed telemetry data
TCS – thermal control system
TKU – control command used at ground processing
TM – telemetry data
TMS – radio-telemetry system
UC – upper composite
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Формат А4

12КС -31684 -1103

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