Counterfeit Components..
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Counterfeit Components..
Counterfeit Components.. Risk & Reality from Counterfeit Presentation Part 1: Major Source of Threat Part 2: The Threat is Refined Part 3: Threat Mitigation @ SMT Part 1: Major Source of Threat China Trip 2008 City of Shenzhen China’s Main Entry Point of Counterfeit Electronics Into the Global Marketplace Reels of 0402 Case Size Capacitors Vehicle Inspection Point Just Outside City of Shantou Electronic Debris Stored in Front and Back Yards Seen While Driving Through City Streets Components Being Washed in the River & Laid on Bank to Dry Components on River Bank Drying Washing Components in River Pulled Components Drying on City Sidewalks, then Separated by Type 0402 Case Size Capacitors ($.0025 ea from Fran. Disty) Pulled Components Stored in Bags, Being Delivered and Awaiting Processing Floor #1 Pulled Components Sorted by Sifting Shantou Warehouse: Boards Stacked, Waiting for Chip Removal Targeted Components Have Already Been Removed Pulled Components Prepared for Counterfeiting Process Remarked Components Ready for Counterfeit Packaging and Distribution thru Shenzhen’s Global Market 1997 Parts Remarked as 2006: Nine Years Difference Counterfeit Cisco Card Grim Reality of the Counterfeit Global Distribution Network Life of a Counterfeit Component • Created 1st week of August, 2010 in Shantou China • 10,000 Identical (lot/dc) parts • All were Immediately put up for sale • Over next 6-12 months the 10,000 Identical (lot/dc) parts have been split up into smaller groups and found new homes around the world Before After UK Canada Beijing Germany NY CA FL Shenzhen Israel Japan Shantou India Philippines This counterfeit lot has found MANY homes Globally over a 612 month period Life Span to Threaten Industry? Indefinite! Counterfeiting: Not Just Components Counterfeit factory box LOGO AUTHENTICATION FAKE REAL Moisture Level Inconsistency On “Factory” Labels Spelling Errors Dec Date John Doe?? Counterfeit OCM “Certificates of Compliance” (C of C) Counterfeit OCM Cert Envelope Over 20 Years of BlackTopping and Remarking Original Date Code 8829 1 2 3 Remarked Date Code 9115 SLOPPY BLACK-TOPPING Laser-Etch Remarking Still Visible After Black-Topping Has Been Removed After Black-Top Removal Laser-Etch Still Remains Part 2: The Threat is Refined New Threat! (July 2009) Highly-Engineered Black-Top Material Designed to Evade Detection on Counterfeited Plastic Encapsulated Microcircuits (PEMS) Exemplar Top Surface Suspect Top Surface Exemplar Top Surface Virtually Identical Surface Features Suspect Top Surface Exemplar Pin-One Cavity Suspect Pin-One Cavity Suspect Pin-One Cavity Suspect Pure Acetone – No Affect Pure Acetone – 7 Day Soak 7 Day Soak – Wipe Test Has No Affect Suspect New Blacktop Material Could Only Be Removed With an X-acto Knife Suspect – scratch test removes blacktop material Scanning Electron Microscope (2 Systems) Exemplar Device Top “Cornrow” Etch Process Suspect Device Top Exemplar Device Side Overspray Visible Suspect Device Side Energy Dispersive X-Ray (2 Systems) Spectrum Analysis of the Suspect Device Top Surface Area y n n o m n o b u i o r m c n a i i t l a C i t n i S T A Suspect Energy Dispersive Spectroscopy (EDX) Test Results on New Blacktop Material Spectrum Analysis of the Exemplar Device Top Surface Exemplar Spectrum Analysis of the Suspect Device Top Surface m u n i m u l A Suspect Scanning Acoustic Microscopy (SAM) Internal Imaging Results Acoustic Microscopy (1 System) Exemplar Device Topside Internal Image Scan Suspect Device Exemplar Suspect Side by Side Comparative Image Analysis would pass since the bonding layout and die features are identical. Exemplar Device Die Identical Die Suspect Device Die New Blacktop Threat- Recap • • • • • • Identical visual surface characteristics Impervious to Acetone (RTS) Identical surface element makeup Identical Real-Time X-Ray images Authentic die Will probably pass functionality So how bad IS the Counterfeit problem we face? Global Impact on Industry Perception of the Counterfeit Problem Counterfeit Problem Perception Global Impact on Industry Reality of the Counterfeit Problem SMT Purchase Order Terms & Conditions re: Counterfeit Product Part 3: Counterfeit Threat Mitigation at SMT SMT Overview • • • • Established in 1995. Independent Stocking Distributor Woman Owned Small Business Over 120,000 line items in-stock of obsolete & DMS-type component products • 72,000 sf. facility specifically engineered for the proper storage, inspection, and distribution of ESD and humidity sensitive electronic components. SMT Corporation Certifications & Memberships • • • • • • • • • • AS9120:2002 ISO9001:2000 ISO14001:2004 OHSAS 18001:2007 ANSI/ESD-20.20:2007 WBENC IDEA ERAI GIDEP AIA CERTIFIED CERTIFIED CERTIFIED CERTIFIED CERTIFIED CERTIFIED MEMBER MEMBER MEMBER MEMBER SMT 72,000 sq ft Facility & Property Holdings 12 Acre site owned by SMT – Purchased in 2010 for Future Facility Expansion 9 Acre site owned by SMT Developed in 2003 Facility Relative Humidity Environmental Controls and Safeguards for Component Storage at SMT Complete Warehouse Dehumidification System Dehumidification System Networked 60-ton “Desert Aire” System installed in critical component storage / handling areas – 45% Max RH allowed year-round. Complete Warehouse Dehumidification System 45% RH Year Round Humidification Systems Multiple networked units installed in critical component handling / inspection areas – 25% Min RH allowed year-round. All humidification systems are integrated with the associated facility HVAC systems. Monitored Humidification Units (3 total) Wall Humidistat (On Network) 60,000 SF ESD Floor Treatments ESD Test Point all Employees must pass thru to reach component work areas. 20,000 sf Blue Warehouse 30,000 sf Red Warehouse Tape / Reel Lab Area - Floor plan S/R Lab Area Data Entry Lab Area Blue Warehouse 20,000 sq ft Red Warehouse 30,000 sq ft Office Areas ESD treated floor area – 60,000 sq ft Incoming Order Processing Area (10 Stations) Outgoing Order Processing Area (12 Stations) Tape & Reel (9 Stations) Baking & Dry Packing (4 Stations) Analysis Labs #1 & 2 - (10 Stations) X-Ray, SEM, EDX & AM Lab Area Sample Preparation Lab Area Minimum Inspection for Open-Market Product • • • • • • • • • Visual Inspection - 100% X-Ray Inspection – 100% XRF Inspection – 2 / lotdc SEM Surface Inspection – 2 / lotdc RTS Inspection – 2 / lotdc Solderability – 2 / lotdc Scratch Test – 2 / lotdc Heated Solvent – 2 / lotdc Decap - Die Verification – 2 / lotdc Product Inspection SMT’s In-House Component Quality & Authentication Analysis Process EMPLOYEE TRAINING! QC Lab Mgr: Jason Romano QC Insp Mgr: Kimberly Costa Documented Visual Inspection Packaging Inspection Package Verification & Condition Marking Permanency (RTS) Heated Solvent Testing (2 Systems) Documented Visual Inspection Checklist Datasheet Comparison Mechanical Verification Documented Datasheet Comparison Data Documented Component Photos FRONT IMAGE REAR IMAGE Documented Photo Inspection Data Documented XRF RoHS Testing X-Ray Fluorescence (2 Systems) Documented XRF-RoHS Test Data Documented Real Time X-Ray Imaging Real-Time X-Ray (2 Systems) Match Pin-Out to Datasheet Intel Intersil Harris OKI Automated Real-Time X-Ray for 100% inspection of parts on reels Automated Real-Time X-Ray (2 Systems) Current X-Ray Field of View (FOV) Current Pass/Fail/Review Data Reference Part Current Part Documented X-Ray Inspection Data Documented Solderability Testing Automated Solderability (2 Systems) Bath Test Globule Test PASS Force Wetting Curve Minimum amount of force required to pass Time Documented Solderability Test Data Documented Acid-Etch Decapsulation & Die Verification Acid-Etch Decapsulation (4 Systems) Documented Die Inspection Data Scanning Electron Microscope (2 Systems) Energy Dispersive X-Ray (2 Systems) Acoustic Microscopy (1 System) A copy of the “Certificate of Analysis” document is shipped with order to verify quality and authentication inspection has taken place Tom Sharpe VP - SMT Corporation [email protected] 203-270-4705 – DD 203-994-9772 - Mobile