Volume a High-end portfolio

System x Univerzita pro
obchodní partnery
Volume a High-end portfolio
Ondra Lorenc
System x CTS
[email protected] ; 731 435 658
© 2014 IBM Corporation
Intel® Xeon® Processor E5 Platform Roadmap
2013
Efficient
performance
4 socket
Efficient
Performance &
Workstation
2 socket
Entry 2 socket
2014
Future
Romley-EP 4S Platform
Intel® Xeon® processor E5-4600 v2 product
family
Intel® C600 series chipset (Patsburg)
Romley-EP Platform
Intel® Xeon® processor E5-2600 v2
product family
Intel® C600 series chipset (Patsburg)
Romley-EN Platform
Intel® Xeon® processor E5-2400 v2
product family
Grantley-EP 4S Platform
Intel® Xeon® processor
E5-4600 v3 product family
Intel® C610 series chipset
(Patsburg)
Grantley-EP Platform
Intel® Xeon® processor
E5-2600 v3 product family
Intel® C610 series chipset
Best balance of performance, power efficiency, and features
to span the diverse needs of Next-Generation Datacenters
Platform generations shown here are solely for
relative positioning to the Grantley platform and
should be used ONLY for Grantley planning.
2
2
© 2014 IBM Corporation
Grantley Processor Support Plan for M5 rack servers
Intel® Xeon® Processor E5-2600 v3 product family: Preliminary SKU line-up
Segmented Optimized
•11 SKUs support @GA
•11 SKUs plan to support
in Refresh 1
•Target November
•5 Embedded SKUs
planned for Refresh 2
Advanced
•95.3% Coverage
•Covered Top BIN
•Covered LP
High Core
Count (HCC)
Medium Core
Count (MCC)
Low Core
Count (LCC)
Basic
Legend
Standard
•Target 1Q
GA
12C
135W
E5-2690 v3
GA
18C
GA
12C
120W
E5-2680 v3
R1
16C
135W
E5-2698 v3
GA
12C
120W
E5-2670 v3
R1
14C
145W
E5-2697 v3
R1
12C
105W
E5-2660 v3
Low Power
R1
14C (
120W
E5-2695 v3
GA
10C
105W
E5-2650 v3
12C
80W
E5-2650L v3
R1
14C (
120W
E5-2683 v3
R1
12C
120W
E5-2685 v3
GA
10C
105W
E5-2640 v3
GA
8C
85W
E5-2630 v3
GA
8C
85W
E5-2620 v3
GA
6C
85W
E5-2609 v3
GA
6C
85W
E5-2603 v3
R1
GA
145W
E5-2699 v3
Data Base SKUs
8C
70W
E5-2630L v3
R1
8C
135W
E5-2667 v3
R1
6C
135W
E5-2643 v3
R1
4C
135W
E5-2637 v3
R1
4C
105W
E5-2623 v3
3
© 2014 IBM Corporation
Memory Stretch Goals
We will be announcing that we exceed the Intel Specs in THREE areas
−
−
−
−
LR DIMMs – 3 DIMMs per channel run at 1866MHz (vs Intel’s 1600MHz)
RDIMMs – 2 DIMMs per channel run at 2133 MHz (vs Intel’s 1866MHz)
16GB RDIMMs ONLY – 3 DIMMs per channel run at 1866MHz (vs Intel’s 1600MHz)
With 3 DIMMs per Channel 4/8GB RDIMMs will run at 1600MHz (Same as Intel’s spec)
System x DDR4 Memory will be branded ‘TruDDR4 Memory’ (Like HP’s Smart
Memory)
If the customer installs any non-TruDDR4 memory, the system will only run the
memory at Intel’s POR speeds
At some point in the future, firmware will be updated to inform the customer if they are
running any non-approved memory
4
© 2014 IBM Corporation
Intel Xeon E5-2600v3 Memory POR
Intel POR
Slots per
Channel
DIMMs per
Channel
RDIMM
LRDIMM
SR/DR
QR
1
1
2133
2133
2
1
2133
2133
2
2
1866
2133
3
1
2133
2133
3
2
1866
2133
3
3
1600
1600
− System x can run 1 or 2 DIMMs at
2133MHz
− System x can run three 16GB DR DIMMs
at 1866MHz
− System x can run 3 LR-DIMMs at
1866MHz
− All other SR/DR DIMMs will run at
1600MHz with 3DPC
IBM Actuals Using TruDDR4 Memory
5
Slots per
Channel
DIMMs per
Channel
RDIMM
LRDIMM
SR/DR
QR
1
1
2133
2133
2
1
2133
2133
2
2
2133
2133
3
1
2133
2133
3
2
2133
2133
3
3
1600/1866
1866
© 2014 IBM Corporation
IBM System x and Flex System Solutions
Solutions
IBM System x3550 M5
IBM Flex System Solution for Oracle RAC
IBM System x3650 M5 IBM Flex System Solution for Desktop Virtualization with Atlantis ILIO
IBM System x3500 M5 (SoD)
IBM Flex System Solution for Microsoft Hyper-V
IBM Flex System™ x240 M5 compute node (RFA Oct 7)
*IBM System x Solution for Microsoft Exchange 2013
NeXtScale nx360 M5 node
*IBM System x Solution for VMware VSAN
IBM NeXtScale System with Water Cool Technology
*IBM System x Solution for Microsoft Fast Track Data WH for SQL
(RFA Sep 23)
2014
(M5 Solutions marked with asterisk on right)
Additional Priorities
IBM Security Key Lifecycle Manager for System x
(RFA Aug 26)
IBM System Networking RackSwitch G7052
IBM GPFS Storage Server (GSS) 21s & 22s (RFA June 2014)
IBM System x3650 M4 BD Ref 1 (RFA Aug 19)
IBM Flex System™ 440 Compute Node (RFA Oct 7)
IBM Flex System™ EN4172 2-port 10Gb Ethernet Adapter (RFA Oct
7)
IBM Flex System Manager (v1.3.3) (No RFA)
6
© 2014 IBM Corporation
Leading Innovation in the 1S & 2S x86 Systems
M5
Broadest Server Portfolio - Spanning 1S & 2S Rack & Tower
E5-2600 v3
Business Critical
Balanced between price and performance
Generous scalability
Lighter tool-less content, less hot swap, cost optimized
redundancy
Mid-level IBM service delivery
Sold by the widest variety of sellers- BPs, ibm.com and
xBSS reps
Entry Value
Superior performance and reliability
Many high end features standard
Maximum scalability
Top tier IBM service
Sold by the widest variety of sellers- BPs, ibm.com and
xBSS reps
General Business
E5-2600 v2
Focused on acquisition cost, not a TCO sale
Competitive basic feature set
Basic mechanicals & little to no redundancy
Entry service methodology
Potentially limited routes, sellers, etc.
x3650 M5
x3550 M5
x3500 M5
x3550 M4
x3650 M4
x3650 M4 HD
x3650 M4 BD
x3500 M4
E5-2400 v2
E5-2400
x3630 M4
x3530 M4
x3300 M4
E3-1200 v2
x3100 M4
x3250 M4
E3-1200 v3
x3100 M5
x3250 M5
7
© 2014 IBM Corporation
IBM x3650 M5
2U Mechanical
IBM x3650 M5
Xeon E5-2600v3 (Haswell EP) (up to 145W)
Processors
24 DDR4 DIMMs
Form factor
2U Rack
Memory Slots
Max Memory
24 x DDR4 (RDIMM or LRDIMM)
Up to 2DPC@2133MHz & stretch goal 3DPC@1866 MHz,
Max 1.5TB
Media bays
ODD Optional (model dependant )
Disk Drive type
SAS/SATA/SSD
HDD bays
SS / HS Max 8x 3.5” or HS 12x 3.5"
SS Max 8x 2.5” or HS 16->24x 2.5"
(With rear disk 24+2 x 2.5" or 12x 3.5 +2x 3.5“+2x2.5” or 8x
3.5” +2x3.5” )
RAID
Slotless RAID (12Gb)/ Support multiple RAID
NIC/TPM
1x IMM & 4x 1Gb Std., optional ML2 or PCIe /Yes
PCIe (x16/x8)
Up to 8 PCIe slots (1/7 or 3/3) (up to 40Gb ML2 NIC capable)
and Slotless RAID
Power
AC 550W/750W/900W platinum and AC 750W Titanium. All
PSU support active/ standby
USB ports
(model dependant)
Up to 3 front (2x 3.0, 1x 2.0)/4 back (2x 3.0, 2x 2.0) /1
internal (3.0), optional +2 HA SD
VGA port
1 front / 1 back
Fan Design
6 x Hot swap redundant fans N+1 design
Light Path
LCD Light Path panel in front (8 or16x 2.5” optional, 8x3.5”
default) - Basic Light Path on all
System MGMT
IMM2 F/O One IMM dedicated port, over any NIC, FoD
upgrade to advanced.
Operating temp.
Up to 40 ℃
Warranty
3 years (parts/labor)
Up to 8 PCIe slots plus 1 dedicated RAID slot
4 Gigabit Ethernet Ports (using BroadCom
BCM5719)
Front accessible USB 3.0 ports
(Top BIN & embedded skus up to 18 core, selected skus for GA)
Optional ML2 slot on riser for CPU1
Optional rear drives (2.5” or 3.5”)
(Post GA) Optional NVMe SSD
Optional 80PLUS Titanium Power Supply
Supported at
5-40oC
Six mechanicals
– 8, 16 or 24 2.5” Hot swap drives
– 12 3.5” Hot swap drives
– 8 or 16 2.5” Hot swap drives + Optical + LCD
– 8 or 16 2.5” Simple swap drives + Optical + LCD
(ServeRAID needed for 16 2.5” Simple swap solution)
– 8 3.5” Simple Swap drives + Optical + LCD
– 8 3.5” Hot swap drives + Optical + LCD
8
Up to 2 Haswell Processors
© 2014 IBM Corporation
What’s new with x3650 M5
Feature
x3650 M4 BD
x3650 M4 HD
x3650 M4
Intel E5-2600 v2,
Up to 130W 12 Cores
Intel E5-2600 v2
Up to 130W 12 cores
Intel E5-2600 v3
Up to 145W 18 cores
(Support selected 11 SKUs at GA, to
cover the rest SKUs at refresh)
increased performance
6 more cores
Possible consolidation of more apps
on same machine, reducing costs
16 Slots (U/R/LR DIMM)
1.35V or 1.5V
Up to 2DPC@1866MHz
Up to 512GB (LRDIMM)
24 Slots (U/R/LR DIMM)
1.35V or 1.5V
Up to 2DPC@1866MHz
Up to 768GB (LRDIMM)
24 slots (U/R/LR/HC DIMM)
1.35V or 1.5V
Up to 2DPC@1866MHz
Up to 768GB (LRDIMM)
24 slots (R/LR DIMM)
1.2V
Up to 2DPC@2133MHz (R) and
3DPC@1866MHz stretch goal
Up to 1.5TB* (LRDIMM)
Better performance
More power saving
Double capacity
Gen2 Tray (6Gb)
12+2x 3.5” HDD/SSD (2.5” SSD in
3.5” HDD tray)
Gen2 Tray (6Gb)
26x 2.5” HDD/SSD or
16x 2.5” HDD/SSD + 16x 1.8” SSD
Gen2 Tray (6Gb)
16x 2.5” or 6x 3.5” HDDs or 32x
1.8” SSD
6x 3.5” SAS/SATA
2.5” Gen3 Tray (6Gb and 12Gb)
8x 3.5” SS SATA (non RAID)
8+2x / 12+2x 3.5”+2x 2.5” SAS/SATA
8x 2.5” SS SATA (non RAID)
24+2x 2.5” HDD/SSD or
16+2x 2.5” HDD/SSD
•More drives support bigger capacity
and more spindles
•SS design for lower entry price
point
•Supports booting from 2 rear
HDD/SSD
•Supports up to 14x 3.5” + 2x 2.5”
12Gb M5210e RoMB
Support Multiple 12Gb Adapters,
1/2/4 GB Flash RAID 5/50, 6/60
(FoD)
12Gb M5210e RoMB
Support Multiple 12Gb Adapters,
1/2/4 GB Flash RAID 5/50, 6/60
(FoD)
6Gb M5110e RoMB
Support Multiple Adapters
1/2/4 GB Flash RAID 5/50, 6/60
(FoD)
12Gb Slotless RAID support
Support Multiple 12Gb Adapters
1/2/4GB Flash and RAID 5/50, 6/60
(FoD)
•Better performance
•Supports booting from 2 rear drives
•Support multiple RAID adapters (up
to 4 RAID adapters)
Disk
RAID
Benefits
Intel E5-2600 v2,
Up to 115W 12 Cores
Processor
Memory
x3650 M5
Non-RAID MTMs available for JBOD
by OS software
Networking
1GbE IMM + 3x 1GbE + optional
Slotless 2x 10 GbE Mezz card
1GbE IMM + 4 x 1GbE + optional
Slotless 2 x 10 GbE Mezz card
1GbE IMM + 4 x 1GbE + optional
Slotless 2 x 10 GbE Mezz card
1GbE IMM + 4 x 1GbE + optional
10/40GbE ML2 card
•Low TCO with Improved
performance up to 40GbE &
flexibility
3 PCIe 3.0
4-6 PCIe 3.0
4-6 PCIe 3.0
1-8 PCIe slots ( support up to 2x
300W GPUs ) plus 1 dedicated RAID
slot
More I/O options & more flexibility
Better support scope/capability for
GPU
Basic
Basic
Advanced
Optional LCD Light Path on selected
models
Flexibility and easy management
750W, 900W AC Platinum level
550W, 750W, 900W AC Platinum
level
750W DC
550W, 750W, 900W AC Platinum
level
750W DC
550W, 750W, 900W AC Platinum
level
750W AC Titanium
Titanium level increases energy
efficiency
Optional
Optional
Optional
Optional
PCIe
Light Path
HS Power
IMM Remote
Presence
9
*available post GA
© 2014 IBM Corporation
Simple Swap
(HW RAID Upgradeable)
x3650 M5 Mechanical Base & Storage Upgrade
A2x
8x 2.5” ODD
optional
B2x
Upgradeable to 16x 2.5” ODD optional
No Rear
HDD
available
Upgradeable to 16x 2.5” ODD optional
Rear HDD
available
8x 3.5” ODD
optional
Hot Swap
C2x, D2x, F2x, G2x, 62x, J2x, L2x, 52x, M2x
8x 2.5” ODD
optional
C4x
8x 3.5” ODD
optional
Storage Dense
D4x
12x 3.5”
no ODD
F4x
8x 2.5” no
ODD
Upgradeable to 16x/24x 2.5” no ODD
Rear HDD
available
10
© 2014 IBM Corporation
11
© 2014 IBM Corporation
x3650 M5 Riser Options -CPU1 & CPU2
Total CPU1 x40 lanes
3
Slotless RAID x8
Riser 1, CPU1 x24
Option 1: x16+x8, OPT#00KA489
Option 2: x8+x8+x8, OPT#00KA498
Option 3: x16+ML2, OPT#00KA504
Option 4: x8+x8+ML2, OPT#00KA519
OPT#00KA489
OPT#00KC504
OPT#00KA498
OPT#00KA519
CPU1: Vertical slot
x8
4 PCI
LP PCIe
PCI
FH/FL PCIe
FH/HL PCIe or
ML2
6
FH/FL PCIe
PCI
7
PCI
8
FH/FL PCIe
FH/HL PCIe
Redundant
PSU x2
5
CPU2: Vertical slot
x16
2
FH/FL PCIe
LP PCIe
1
PCI
Total CPU2 x40 lanes
PCIe Slots 5-8
require the second
processor
Riser 2, CPU2 x24
Option 1: x16+x8,
OPT#00KA489
Option 2:
x8+x8+x8,
OPT#00KA489
OPT#00KA498
OPT#00KA498
Riser
00KA489 and
00KC504 are
for GPUs
(with double
width x16
slot),
BUT GPU still
CTO only.
12
© 2014 IBM Corporation
x3550 M5 2S 1U Rack
1U Mechanical
Xeon E5-2600v3 (Haswell EP) (up to 145W)
24 DDR4 DIMMs
Up to 3 PCIe slots plus 1 dedicated RAID slot
4 Gigabit Ethernet Ports (using BroadCom
BCM5719)
Front accessible USB 3.0 ports
Optional ML2 slot on riser
Optional rear drives (2x2.5” on 10 drive model
only)
IBM x3550 M5
Processors
Up to 2 Haswell Processor
(support Top BIN and embedded SKUs
up to 18C, selected SKUs at GA)
Form factor
1U Rack
Memory Slots
Max Memory
24x DDR4 (R/LR) DIMM
Up to 2DPC@2133MHz & stretch goal
3DPC@1866 MHz, Max 1.5TB
Media bays
ODD (Optional model dependent)
Disk Drive type
SAS/SATA/SSD
HDD bays
HS Max 10 +2 x2.5” or 4x 3.5” HDDs
SS Max 8x 2.5” or 4x 3.5” SATA HDDs
RAID
Slotless RAID (12Gb)
NIC/TPM
1x IMM2 & 4x 1Gb (std.), optional ML2 or
PCIe / Yes
PCIe (x16/x8)
Up to 3 PCIe slots (3/0) (up to 40Gb ML2 NIC
capable) and Slotless RAID
Power
AC 550W/750W/900W Platinum and
AC 750W Titanium. All PSUs support
Active/Standby
USB ports
(model
dependent)
Up to 3 front (2x 3.0, 1x 2.0)/4 back (2x 3.0,
2x 2.0) /1 internal (3.0), optional +2 HA SD
VGA ports
1 front / 1 back
Fan Design
Up to 8x Hot swap redundant fans
Light Path
Optional LCD panel in front for 4x or 8x 2.5”
HDD models.
System MGMT
IMM2.1, One IMM port , over any NIC, FoD
upgrade to IMM advanced
Operating Temp.
Up to 40℃
Warranty
3 years (parts/labor)
(Post GA) Optional NVMe SSD
Optional 80PLUS Titanium Power Supply
Supported at 5-40oC
Five mechanicals
– 10 2.5” Hot swap drives
– 4 or 8 2.5” Hot swap drives + Optional Optical + LCD
– 4 or 8 2.5” Simple swap drives + Optional Optical + LCD
– 4 3.5” Simple Swap drives + Optional Optical
– 4 3.5” Hot swap drives + Optional Optical
13
© 2014 IBM Corporation
What’s New with the x3550 M5
Feature
x3530 M4
x3550 M4
Benefits
Intel E5-2600 v2,
Up to 95W 8 Cores
Intel E5-2600 v2
Up to 130W 12 cores
Intel E5-2600 v3 series
70W, 80W, 85W, 105W, 120W,
135W, 145W
4-core, 6-core, 8-core, 10-core,
12-core, 14-core, 16-core, 18core
increased performance
6 more cores
Possible consolidation of more
apps on same machine, reducing
costs
12 Slots (U/R/LR DIMM)
1.35V or 1.5V
Up to 2DPC@1600MHz
Up to 384GB (LRDIMM)
4 channels per CPU
24 slots RDIMM, 16 slots UDIMM
1.35V memory
Max 1DPC@1866MHz (RDIMM)
Max. 768GB LRDIMM
4 channels per CPU
24x DDR4 (R/LR) DIMM
Max 1.5TB with 64GB LRDIMM
Up to 2DPC@2133MHz &
3DPC@1866 MHz)
Better performance
More power saving
Double capacity
Disk
Gen2 Tray
8x 2.5” SAS/SATA with ODD
(optional)
4x 3.5” SAS/SATA
Gen2 Tray
8x 2.5” SAS/SATA with ODD
(optional)
3x 3.5” SAS/SATA
Gen3 Tray (6Gb and 12Gb)
4 x 3.5” SS SATA (non RAID)
4 x 3.5” SAS/SATA
8 x 2.5” SS SATA (non RAID)
4/8/10/12x 2.5” HDD/SSD
•Higher 2.5” and 3.5” spindle count
•Higher maximum capacity per1U
server
•SS design for lower entry price point
•Supports up to 12x 2.5” Drives
RAID
6Gb Slotless RAID
1/2 GB Flash RAID 5/50, 6/60 (FoD)
6Gb/12Gb Slotless RAID
1/2/4 GB Flash RAID 5/50, 6/60
(FoD)
Full 12Gb RAID support
RAID options with 1/2/4GB Flash
and RAID 5/50, 6/60 (FoD)
•Better performance
Networking
2 + 2 (FoD) 1GbE
1GbE IMM + 4 x 1GbE + optional
Slotless 2 x 10 GbE Mezz card
1GbE IMM + 4 x 1GbE + optional
10/40GbE ML2 card
•Low TCO with Improved
performance & flexibility
PCIe
2 PCIe 3.0
2 PCIe 3.0
plus 1 dedicated RAID slot
2 with ML2 or 3 PCIe 3.0 slots
plus 1 dedicated RAID slot
More I/O options & more flexibility
Lightpath
Basic, optional advanced for 2.5”
model
Advanced
Optional LCD Light path Diagnostic
Easy management
HS Power
460W FIX
460W, 675W AC Platinum level
675W DC
550W, 750W, 900W AC Platinum
level
750W DC
550W, 750W & 900W Platinum,
Redundant
750W Titanium – Redundant
Active-Standby mode
Energy Star 2.0 Compliance
Titanium level increases energy
efficiency
Active-Standby mode save more
energy
IMM Remote
Presence
Optional
Optional via FOD
Optional via FOD
Processor
Memory
14
x3550 M5
© 2014 IBM Corporation
x3550 M5 Mechanical Base & Storage Upgrade
Simple Swap
Mechanical Base
Upgrade Path
B2x
4x 3.5” opt ODD, SS
A2x
4x 2.5” opt ODD, SS
8x 2.5” opt ODD, SS
Storage Density
Hot Swap
C4x
4x 3.5” opt ODD, HS
C2x, D2x, F2x, H2x, J2x, L2x, M2x, 32x, 42x, 52x, 62x
4x 2.5” opt ODD, HS
8x 2.5” opt ODD, HS
G2x
10x 2.5” no ODD, HS
12x 2.5” no ODD, HS
(+2 rear drive)
15
© 2014 IBM Corporation
Main Refresh
Schedule still being worked – assume 1Q announce, early 2Q GA for now
Intel Embedded CPUs (E5-2608L v3, E5-2618L v3, E5-2628L v3, E5-2648L v3, E5-2658
v3) and workstation SKU (E5-2687W)
32GB RDIMM (8 Gbit technology)
Additional power supplies – 1500W Platinum, 900W -48v DC
SD Media Option
Network Cards
−
−
−
−
Broadcom NetXtreme II 1xGbE BaseT Adapter for IBM System x
Broadcom NetXtreme II 2xGbE BaseT Adapter for IBM System x
Solarflare SFN5162F 2x10GbE SFP+ Performant Adapter for IBM
System x Intel X540-T2 Dual Port 10GBaseT Adapter for IBM System x
All the remaining SSDs
NVMe Upgrade Kit
New GPUs – Xeon Phi 3120A, 7120A, NVIDIA M40, M60, K420, K620, K2200, K4200,
K5200, K6000, Tesla K20c, K80
16
© 2014 IBM Corporation
How we stack up against the competition
× Can’t run @ 3 DPC@ 1866MHz
× Support 4 SS HDDs only
× Only has 10x 2.5” on 1U
× Lacks LCD Light Path panel
× Less PCIe Slots
× Doesn’t support Titanium PSU
× Less efficient cooling design
× Inability to support up to 4 RAID Adapters
× Can’t support SS HDDs
× Only has 10x 2.5” on 1U
× No 3.5” available on 1U
× Less PCIe Slots & USB Ports
× No Ethernet standard on planar
× Less efficient cooling design
× Inability to support up to 4 RAID Adapters
× 1.8” SSD old technology
× Substandard amount of storage capacity
× Lacks LCD Light Path panel
× Less PCIe Slots
× Doesn’t support Titanium PSU
× Less efficient cooling design
× Inability to support up to 4 RAID Adapters
Where is Oracle?
1717
© 2014 IBM Corporation
x3650 M5 Competitive Analysis
IBM x3650 M5
Base Program
CPU SKU
Memory slots
Max. Memory
3DPC@1866MHz
PCI slots
SS 2.5" / 3.5"
HS 2.5"
HS 2.5" High Density
HS 3.5"
HS 3.5" High Density
NVMe
NIC 1Gb LOM
NIC Mezz
GPU support
Power Supply Platinum
Power Supply Titanium
Power Supply DC
Lightpath
Fan zone and fans
Temperature
USB 3.0+2.0 (F / R / I)
Other Card
IBM Advantages:
Support 1.5TB memory and 3DPC@1866MHz
Up to 16 Simple Swap HDDs
More PCIe slot support
Titanium PSU
Dual Fan Zones design
Higher number of USB slots
18
HP DL380 G9
HP DL180 G9
11 – Post GA & Refresh 1
22 + WS
9, up to 2660
(22+5)
24
24
16
1536
768
512
Yes
No
No
8+RAID
6+RAID
6
16 / 8 (JBOD)
0 / 4 (SW RAID)
0 / 4 (SW RAID)
8>16>24 (+2)
8 > 16 (+2)
8 > 16
24+2
24+2
NA
8+2 (2.5" or 3.5")
NA
8
12+2+2x2.5"
12+3 or 12+2x2.5"
12
Advantaged - Refresh 1 (8)
NA
NA
4
4
2
ML2 (PCI)
FlexibleLOM
FlexibleLOM (PCI)
Up to 2x 300W
Up to 2
NA
550/750/900 - Refresh 1
500/800/1400
550 (Silver)
(1500)
750
NA
NA
Refresh 1 (750 @94%)
NA
NA
LCD
Optional SID
NA
Dual zones N+1, 6
N+1, 6
N+1, 5
Standard 5-40
Standard 10-35, 5-45(Limited) Standard 10-35, 5-45(Limited)
1+2 / 2+2 / 1+0
1+2 / 2+0 / 2+0
1 or1 / 2+0 / 1+0
Refresh 1 (2 SD)
1 SD
1 SD
Disadvantage
IBM Advantages:
1.5TB vs. 768GB
3DPC@1866MHz
+2 PCIe slot support
Up to 16 SS HDDs
Titanium PSU
LCD Lightpath
Dual Fan Zones design
More USB
Advantage
IBM Advantages:
Support 18C SKU
1.5TB vs. 512GB
+2 & PCIe slot
Up to 16 SS HDDs
More HHD/SSD
2 more 1Gb LOM
Platinum & Titanium PSU
LCD Lightpath
Dual Fan Zones design
More USB
Dell R730xd
Dell R730
Cisco UCS C240 M4
22
22
22
24
1536
Yes
6+RAID
NA
NA
24+2
8+18x1.8"+2x2.5"
12 + 4 internal +2x2.5"
4
0
FlexLOM
NA
24
1536
Yes
7+RAID
NA (SW RAID)
8 > 16
NA
8
NA
NA
0
FlexLOM
Up to 2x 300W
24
768
Yes
6+RAID
8 / 8 (SW RAID)
8 > 16
24 + 2 (internal SSD)
8
12 + 2 (internal SSD)
NA
4
mLOM
Up to 2
495/750/1100/1600
495/750/1100/1600
650/1200/1400
750
1100 @92%
NA
TBD
TBD
1/2/1?
2 SD + Vflash
750
1100 @92%
LCD
TBD
TBD
2/2/1?
2 SD + Vflash
NA
930 @TBD
TBD
TBD
TBD
2+0 / 2+0 / 0
2 SD
IBM Advantages:
+2 PCIe slot
Up to 16 SS HDDs
1.8” SSD is old tech.
No 1Gb LOM
More GPU support
Dual Fan Zones design
More USB
IBM Advantages:
+1 and PCIe slot support
Up to 16 SS HDDs
More HDD/SSD
No 1Gb LOM
Dual Fan Zones design
More USB
IBM Advantages:
1.5TB vs. 768GB
+2 and PCIe slot support
Up to 16 SS HDDs
More HDD/SSD
Titanium PSU
LCD Lightpath
Dual Fan Zones design
More USB
© 2014 IBM Corporation
x3550 M5 Competitive Analysis
Base program
CPU SKU
Memory slots
Max. Memory
3DPC@1866MHz
PCI slots
SS 2.5" / 3.5"
HS 2.5"
HS 3.5"
NVMe
NIC 1Gb Lom
NIC Mezz
GPU support
Power Supply Platinum
Power Supply Titanium
Power Supply DC
Lightpath
Fan zone and fans
Tempreture
USB 3.0+2.0 (F / R / I)
Other Card
IBM
x3550 M5
HP
DL360 G9
HP
DL160 G9
Dell
R630
CISCO
UCS C220 M4
11
24
1536
Yes
3+RAID
8/4
Up to 12
4
Refresh 1 (4)
4
ML2 (PCI)
1
550/750/900- Refresh 1 (1500)
750
Refresh 1 (750 @94%)
LCD
Dual zones N+1, 8
5-40
1+2 / 2+1 / 1+0
Refresh 1 (2 SD)
22 + WS
24
768
No
3+RAID
8 / 4 (SW RAID)
Up to 10
4
NA
4
FlexibleLOM
Up to 2
500/800/1400
NA
NA
Optional SID
N+1, 6
10-35, 5-45(S)
1+0 / 2+0 / 2+0
1 SD
9, upto 2660
16
512
No
3+RAID
8 / 4 (SW RAID)
Up to 8
4
NA
2
FlexibleLOM
Up to 2
550 (Silver)
NA
NA
Optional SID
N+1, 6
10-35, 5-45(S)
1+1 / 2+0 / 1+0
1 SD
22
24
768
Yes
3+RAID
8 / 4 (SW RAID)
Up to 10
NA
4
0
FlexLOM
TBD
495/750/1100
750
1100 @92%
LCD
N+1, 7
TBD
1/2 ?
2 SD + Vflash
22
24
768
Yes
2+RAID+ mLOM
8 / 4 (SW RAID)
Up to 10
4
NA
2
mLOM
NA
770
NA
NA
TBD
TBD
TBD
2+0 / 2+0 / 0
2 SD
IBM Advantages:
1.5TB Announced
3DPC@1866MHz
Titanium PSU
LCD Lightpath
Dual Fan Zones design
More USB
IBM Advantages:
IBM Advantages:
IBM Advantages:
Support 18C SKU
1.5TB vs. 512GB
+1 PCIe slot
Additional 2.5” HHDs
2 more 1GbE LOM
Titanium PSU
LCD Lightpath
Dual Fan Zones design
More USB
1.5TB Announced
No 3.5” HDD Support
1.8” SSD is old tech
No 1GbE LOM
Superior Light Path
Dual Fan Zones design
More USB
1.5TB vs. 768GB
+1 PCIe slot
Up to 16 SS HDDs
More 2.5” HDD/SSD
+2x 1GbE on planar
GPU Support
Platinum & Titanium PSU
LCD Lightpath
Operating Temperature
Dual Fan Zones design
More USB
IBM Advantages:
Support 1.5TB memory & 3DPC@1866MHz
Up to 8 Simple Swap HDDs
Better PCIe slot support
Titanium PSU
Superior Light Path Design
Dual Fan Zones design
More USB design
19
Disadvantage
Advantage
© 2014 IBM Corporation
14+ years of expertise in Enterprise X-Architecture, has driven
successively-more powerful performance, availability and
reliability
Enterprise X-Architecture
Six generations of server
technology. Each new generation
of servers has raised the industry
bar.
better performance, higher
customer satisfaction
benchmarks
Continued efforts to form new
strategic partnerships and
develop customer-driven
solutions
Continued
investment
in EXA
X6
eX5
X4
X3
EXA2
#1 market share
100+ Number One
Benchmarks
EXA
1st VMware joint
development partner
Largest SAP HANA system
in the world
business-critical workloads
foundation for virtualization
>$1B invested in EXA
technology
facilitates private or hybrid cloud model
20
© 2014 IBM Corporation
X6 rack servers have delivered numerous “firsts…”
#1 in uptime1
1
#1 system
availability
#
#1 market
share for x86
4-socket and
up systems2
SAP HANA
Market Leader
Five #1
benchmarks
since launch
The latest ITIC 2014 reliability survey ranks IBM System x servers as the most reliable for sixth straight year..
2 Per IDC.
21
© 2014 IBM Corporation
Benchmarks: X6 servers deliver #1 performance in real world
applications
#1 Transaction
Processing
#1 Virtualization
5576.27 tpsE @
$188.69/tpsE1
2081 @ 116 VMs on
SPECvirt_sc20131
#1 SAP®
Applications
Sales &
Distribution
2-Tier
4 -socket
#1 Business
Intelligence and
Decision Support
519,976 QphH
1.36 USD / QphH
#1 Java
Application
199752 SPECjbb2013MultiJVM max-jOPS
#1 SAP®
Applications
Sales &
Distribution
2-Tier
8-socket
25,000 users with
.98 sec response
time
49,000 users with
.85 sec response
time
136,670 SAPs
delivering 2.7M
business
processed line
items per hour
271,080 SAPs
delivering 5.4M
business
processed line
items per hour
1 #1 #1 #1 #1 #1
#
Feb 16 2014
TPC-E
Feb 20 2014
Feb 18 2014
SpecVIRT
SAP
April 15 2014
TPC-H
March 17 2014
SPECJBB
June 16 2014
SAP
IBM CPO Case Study: The x3850 X6 with eXFlash Memory-Channel Storage Outperforms HP
Result in a nominal case:
- 2.8x TPS can be achieved with x3850 X6 + eXFlash DIMMs vs. HP DL580 Gen8 + SSDs.
- 280% higher performance for an increase in hardware cost of approx. 7% (w/ eXFlash DIMMs)
Access the study here: IBM/PW
22
© 2014 IBM Corporation
X6 delivers more innovative agility features than competitive
platforms
x3950 X6
x3850 X6
FRONT
Swappable books fit
4-S and 8-S servers
BACK
23
© 2014 IBM Corporation
X6 servers accommodate multiple generations of processors in
one system
Accommodate
multiple generations of
processors in one system
simply by swapping out Compute
Books rather than buying a new
server
Gen 1
x3950 X6
Gen 2
x3850 X6
Gen 3
24
© 2014 IBM Corporation
Leverage FlexNode capability: configure between scaleup workloads & clustered applications easily
x3950 X6
FlexNode
multiple x3950
X6 servers
into a cluster
of
4-way servers
x3950 X6
Or FlexNode
x3950 X6
servers into
scale-up 8way servers
25
25
© 2014 IBM Corporation
Feature/Function scorecard for x3850 X6
X3850 X6
HP – DL 580 G8
Dell – R920
Cisco – C460 M4
Form Factor
4S 4U
4S 4U
4S 4U Rack
4S 4U
4S 10U
Processor SKU
E7-4800/8800 v2
E7-4800/8800 v2
E7-2800/4800/8800
v2
E7-4800/8800 v2
E7-4800/8800 v2
(not offering the 8850
v2, 8870 v2, 8880 v2
and 8890 v2)
(E7-4850v2, E7-4870v2,
(not offering the 8870 v2,
8880 v2, and 8890 v2)
E7-4880v2, E7-4890v2,
and E7-8893v2)
Scalability
2, 4 native
8-way via Kit
2, 4 native
2, 4 native
2, 4 native
1 to 4S
Memory
6TB max
4,8,16GB RDIMM
32, 64GB LRDIMM
3TB Max (96 x 32GB)
4, 8, 16GB RDIMM
32GB LRDIMM
8 Cartridges (12pC)
** 6TB “later in the year”
6TB max
4,8,16GB RDIMM
32, 64GB LRDIMM
3TB max
8, 16, 32GB
6TB max
8,16GB RDIMM
32, 64GB LRDIMM
SAS/SATA SSD
6.4TB (16 x 400GB)
12.8TB (8 x 1.6TB)
8TB (10 x 800GB)
19.2TB
(24 x 800GB)
12.8TB max
(8 x 1.6TB SSDs)
25.6TB
(16 x 1.6TB 2.5”)
SAS HDD
9.6TB max
(8 x 1.2TB 2.5”)
12TB (10 x 1.2TB)
28.8TB
(24 x 1.2TB 2.5”)
9.6TB max
(8 x 1.2TB HDD)
19.2TB
(16 x 1.2TB 2.5”)
Flash DIMMs
12.8TB (32 x 400GB
eXFlash DIMMs)
None
None
None
None
PCIe Flash
21.6TB (9 x 2.4TB PCI
SSD Adapter) – Rear
30TB (10 x 3.0TB PCIe
io)
12.8TB
(8 X 1.6TB NVMe
PCIe SSDs)
18.0TB (6 x 3.0 MLC
Fusion io)
12TB (10 x 1.2TB)
PCIe SSD
PCIe IO
11 + MezzLOM
FlexLOM:
•Quad 1GbE
•Dual 10GbE SFP+
•Dual 10Gb FlexFabric
SFP+
9 PCIe slots
9 PCIe
10 + Additional
dedicated internal slot
available to configure
RAID support
12, expandable to 56
externally
Legend
26
Fujitsu –
Primequest 2400E
Advantage
© 2014 IBM Corporation
4 Compute Books
Storage Book
27
© 2014 IBM Corporation
The modular “book” design also provides clients front and rear
access to modular components
• 3 PCle slots per book
Primary I/O Book
• 2 IO Book Options per
platform
• Half-length (HL) I/O Books
• Optional Full-length (FL)
I/O Books
• Support 300W GPUs in FL
• Mix HL and FL
• Integrated Management
• Module (IMM)
• 1 Dedicated ML Socket
• 3 PCIe Slots
• Internal USB
• USB 2.0
28
© 2014 IBM Corporation
© 2014 IBM Corporation
XSP03736-USEN-00